Modeling of trench structures in integrated circuits for fast isolation effectiveness assessment

M. Grau Novellas, R. Serra, M. Rose

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

2 Citations (Scopus)

Abstract

In this paper, an analytical modeling methodology is proposed for trench structures in integrated circuit substrates. It is based on a modal characterization of the different doping profiles, dealing with trenches as discontinuities transverse to the direction of propagation. Finally, a method for fast isolation effectiveness assessment of a trench integrated in different substrate types is proposed, that includes the effects of mode
Original languageEnglish
Title of host publicationProceedings of the 2016 International Symposium on Electromagnetic Compatibility (EMC EUROPE), 5-9 September 2016, Wroclaw, Poland
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Pages536-540
Number of pages5
Volume2016-November
ISBN (Electronic)978-1-5090-1416-3
ISBN (Print)978-1-5090-1417-0
DOIs
Publication statusPublished - 8 Nov 2016
Event2016 International Symposium on Electromagnetic Compatibility (EMC EUROPE 2016) - Wroclaw, Poland
Duration: 5 Sep 20169 Sep 2016

Conference

Conference2016 International Symposium on Electromagnetic Compatibility (EMC EUROPE 2016)
Abbreviated titleEMC EUROPE 2016
CountryPoland
CityWroclaw
Period5/09/169/09/16

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