Modeling of trench structures in integrated circuits for fast isolation effectiveness assessment

M. Grau Novellas; R. Serra; M. Rose

doi:10.1109/EMCEurope.2016.7739158

Modeling of trench structures in integrated circuits for fast isolation effectiveness assessment

M. Grau Novellas, R. Serra, M. Rose

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

2 Citations (Scopus)

Abstract

In this paper, an analytical modeling methodology is proposed for trench structures in integrated circuit substrates. It is based on a modal characterization of the different doping profiles, dealing with trenches as discontinuities transverse to the direction of propagation. Finally, a method for fast isolation effectiveness assessment of a trench integrated in different substrate types is proposed, that includes the effects of mode

Original language	English
Title of host publication	Proceedings of the 2016 International Symposium on Electromagnetic Compatibility (EMC EUROPE), 5-9 September 2016, Wroclaw, Poland
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Pages	536-540
Number of pages	5
Volume	2016-November
ISBN (Electronic)	978-1-5090-1416-3
ISBN (Print)	978-1-5090-1417-0
DOIs	https://doi.org/10.1109/EMCEurope.2016.7739158
Publication status	Published - 8 Nov 2016
Event	2016 International Symposium on Electromagnetic Compatibility, EMC EUROPE 2016 - Wroclaw, Poland Duration: 5 Sept 2016 → 9 Sept 2016

Conference

Conference	2016 International Symposium on Electromagnetic Compatibility, EMC EUROPE 2016
Abbreviated title	EMC EUROPE 2016
Country/Territory	Poland
City	Wroclaw
Period	5/09/16 → 9/09/16

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10.1109/EMCEurope.2016.7739158

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Grau Novellas, M., Serra, R., & Rose, M. (2016). Modeling of trench structures in integrated circuits for fast isolation effectiveness assessment. In Proceedings of the 2016 International Symposium on Electromagnetic Compatibility (EMC EUROPE), 5-9 September 2016, Wroclaw, Poland (Vol. 2016-November, pp. 536-540). Article 7739158 Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EMCEurope.2016.7739158

Grau Novellas, M. ; Serra, R. ; Rose, M. / Modeling of trench structures in integrated circuits for fast isolation effectiveness assessment. Proceedings of the 2016 International Symposium on Electromagnetic Compatibility (EMC EUROPE), 5-9 September 2016, Wroclaw, Poland. Vol. 2016-November Piscataway : Institute of Electrical and Electronics Engineers, 2016. pp. 536-540

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abstract = "In this paper, an analytical modeling methodology is proposed for trench structures in integrated circuit substrates. It is based on a modal characterization of the different doping profiles, dealing with trenches as discontinuities transverse to the direction of propagation. Finally, a method for fast isolation effectiveness assessment of a trench integrated in different substrate types is proposed, that includes the effects of mode",

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Grau Novellas, M, Serra, R & Rose, M 2016, Modeling of trench structures in integrated circuits for fast isolation effectiveness assessment. in Proceedings of the 2016 International Symposium on Electromagnetic Compatibility (EMC EUROPE), 5-9 September 2016, Wroclaw, Poland. vol. 2016-November, 7739158, Institute of Electrical and Electronics Engineers, Piscataway, pp. 536-540, 2016 International Symposium on Electromagnetic Compatibility, EMC EUROPE 2016, Wroclaw, Poland, 5/09/16. https://doi.org/10.1109/EMCEurope.2016.7739158

Modeling of trench structures in integrated circuits for fast isolation effectiveness assessment. / Grau Novellas, M.; Serra, R.; Rose, M.
Proceedings of the 2016 International Symposium on Electromagnetic Compatibility (EMC EUROPE), 5-9 September 2016, Wroclaw, Poland. Vol. 2016-November Piscataway: Institute of Electrical and Electronics Engineers, 2016. p. 536-540 7739158.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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Grau Novellas M, Serra R, Rose M. Modeling of trench structures in integrated circuits for fast isolation effectiveness assessment. In Proceedings of the 2016 International Symposium on Electromagnetic Compatibility (EMC EUROPE), 5-9 September 2016, Wroclaw, Poland. Vol. 2016-November. Piscataway: Institute of Electrical and Electronics Engineers. 2016. p. 536-540. 7739158 doi: 10.1109/EMCEurope.2016.7739158

Modeling of trench structures in integrated circuits for fast isolation effectiveness assessment

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