Abstract
Ultra-shallow arsenic and boron diffusion in both strained and strain-relaxed SiGe has been investigated in this paper. Significant arsenic diffusion enhancement and boron diffusion retardation have been observed. Strained SiGe was found to have a stronger arsenic diffusion enhancement. Empirical equations in Arrhenius form have been created and incorporated into numerical simulation to successfully model the diffusion dopant profiles.
| Original language | English |
|---|---|
| Title of host publication | 2005 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2005 |
| Place of Publication | Piscataway |
| Publisher | Institute of Electrical and Electronics Engineers |
| Pages | 75-78 |
| Number of pages | 4 |
| ISBN (Print) | 4990276205, 9784990276201 |
| DOIs | |
| Publication status | Published - 1 Dec 2005 |
| Externally published | Yes |
| Event | 2005 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2005 - Tokyo, Japan Duration: 1 Sept 2005 → 3 Sept 2005 |
Conference
| Conference | 2005 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2005 |
|---|---|
| Country/Territory | Japan |
| City | Tokyo |
| Period | 1/09/05 → 3/09/05 |