Microstructure evolution of tin-lead solder

R.L.J.M. Ubachs; P.J.G. Schreurs; M.G.D. Geers

Microstructure evolution of tin-lead solder

R.L.J.M. Ubachs, P.J.G. Schreurs, M.G.D. Geers

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	English
Title of host publication	Proceedings of the conference EuroSimE 2003, 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems : Aix-en-Provence, France, March 30 - April 2, 2003
Editors	L.J. Ernst
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Number of pages	7
ISBN (Print)	0-7803-7054-6
Publication status	Published - 2003

Cite this

Ubachs, R. L. J. M., Schreurs, P. J. G., & Geers, M. G. D. (2003). Microstructure evolution of tin-lead solder. In L. J. Ernst (Ed.), Proceedings of the conference EuroSimE 2003, 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems : Aix-en-Provence, France, March 30 - April 2, 2003 Institute of Electrical and Electronics Engineers.

Ubachs, R.L.J.M. ; Schreurs, P.J.G. ; Geers, M.G.D. / Microstructure evolution of tin-lead solder. Proceedings of the conference EuroSimE 2003, 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems : Aix-en-Provence, France, March 30 - April 2, 2003. editor / L.J. Ernst. Piscataway : Institute of Electrical and Electronics Engineers, 2003.

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booktitle = "Proceedings of the conference EuroSimE 2003, 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems : Aix-en-Provence, France, March 30 - April 2, 2003",

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Ubachs, RLJM, Schreurs, PJG & Geers, MGD 2003, Microstructure evolution of tin-lead solder. in LJ Ernst (ed.), Proceedings of the conference EuroSimE 2003, 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems : Aix-en-Provence, France, March 30 - April 2, 2003. Institute of Electrical and Electronics Engineers, Piscataway.

Microstructure evolution of tin-lead solder. / Ubachs, R.L.J.M.; Schreurs, P.J.G.; Geers, M.G.D.
Proceedings of the conference EuroSimE 2003, 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems : Aix-en-Provence, France, March 30 - April 2, 2003. ed. / L.J. Ernst. Piscataway: Institute of Electrical and Electronics Engineers, 2003.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Microstructure evolution of tin-lead solder

AU - Ubachs, R.L.J.M.

AU - Schreurs, P.J.G.

AU - Geers, M.G.D.

PY - 2003

Y1 - 2003

M3 - Conference contribution

SN - 0-7803-7054-6

BT - Proceedings of the conference EuroSimE 2003, 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems : Aix-en-Provence, France, March 30 - April 2, 2003

A2 - Ernst, L.J.

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

ER -

Ubachs RLJM, Schreurs PJG, Geers MGD. Microstructure evolution of tin-lead solder. In Ernst LJ, editor, Proceedings of the conference EuroSimE 2003, 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems : Aix-en-Provence, France, March 30 - April 2, 2003. Piscataway: Institute of Electrical and Electronics Engineers. 2003