Microstructural stability and failure modes in eutectic Sn-Ag-Cu solder

M.A. Matin; W.P. Vellinga; M.G.D. Geers

doi:10.1109/ESIME.2004.1304060

Microstructural stability and failure modes in eutectic Sn-Ag-Cu solder

M.A. Matin
, W.P. Vellinga
, M.G.D. Geers

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

2 Citations (Scopus)

Abstract

Microstructural stability in eutectic Sn-3.8Ag-0.7Cu (SAC) solder has been investigated during isothermal annealing at 401 K or 454 K and cyclic annealing between 253 K to 401 K. Bulk Ag/sub 3/Sn and Cu/sub 6/Sn/sub 5/ intermetallics are found to be quite stable at these elevated temperatures. The distribution of local strain fields within SAC solder interconnections have been investigated under shear loading at ambient temperature by a digital image correlation (DIC) technique. DIC measurements show inhomogeneous distribution of strain fields in the solder interconnections, and localization of strains predominantly near the interface(s). Creep experiments have also been performed at 373 K and 423 K and are compared to the shear loading experiments. SAC solder interconnections show the largest plastic deformation and the highest creep-resistance and exhibit fracture in ductile mode.

Original language	English
Title of host publication	Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium
Editors	L.J. Ernst, G.Q. Zhang, P. Rodgers, O Saint Leger
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Pages	337-340
ISBN (Print)	0-7803-8420-2
DOIs	https://doi.org/10.1109/ESIME.2004.1304060
Publication status	Published - 2004

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10.1109/ESIME.2004.1304060

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Matin, M. A., Vellinga, W. P., & Geers, M. G. D. (2004). Microstructural stability and failure modes in eutectic Sn-Ag-Cu solder. In L. J. Ernst, G. Q. Zhang, P. Rodgers, & O. Saint Leger (Eds.), Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium (pp. 337-340). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ESIME.2004.1304060

Matin, M.A. ; Vellinga, W.P. ; Geers, M.G.D. / Microstructural stability and failure modes in eutectic Sn-Ag-Cu solder. Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium. editor / L.J. Ernst ; G.Q. Zhang ; P. Rodgers ; O Saint Leger. Piscataway : Institute of Electrical and Electronics Engineers, 2004. pp. 337-340

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abstract = "Microstructural stability in eutectic Sn-3.8Ag-0.7Cu (SAC) solder has been investigated during isothermal annealing at 401 K or 454 K and cyclic annealing between 253 K to 401 K. Bulk Ag/sub 3/Sn and Cu/sub 6/Sn/sub 5/ intermetallics are found to be quite stable at these elevated temperatures. The distribution of local strain fields within SAC solder interconnections have been investigated under shear loading at ambient temperature by a digital image correlation (DIC) technique. DIC measurements show inhomogeneous distribution of strain fields in the solder interconnections, and localization of strains predominantly near the interface(s). Creep experiments have also been performed at 373 K and 423 K and are compared to the shear loading experiments. SAC solder interconnections show the largest plastic deformation and the highest creep-resistance and exhibit fracture in ductile mode.",

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Matin, MA, Vellinga, WP & Geers, MGD 2004, Microstructural stability and failure modes in eutectic Sn-Ag-Cu solder. in LJ Ernst, GQ Zhang, P Rodgers & O Saint Leger (eds), Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium. Institute of Electrical and Electronics Engineers, Piscataway, pp. 337-340. https://doi.org/10.1109/ESIME.2004.1304060

Microstructural stability and failure modes in eutectic Sn-Ag-Cu solder. / Matin, M.A.; Vellinga, W.P.; Geers, M.G.D.
Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium. ed. / L.J. Ernst; G.Q. Zhang; P. Rodgers; O Saint Leger. Piscataway: Institute of Electrical and Electronics Engineers, 2004. p. 337-340.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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N2 - Microstructural stability in eutectic Sn-3.8Ag-0.7Cu (SAC) solder has been investigated during isothermal annealing at 401 K or 454 K and cyclic annealing between 253 K to 401 K. Bulk Ag/sub 3/Sn and Cu/sub 6/Sn/sub 5/ intermetallics are found to be quite stable at these elevated temperatures. The distribution of local strain fields within SAC solder interconnections have been investigated under shear loading at ambient temperature by a digital image correlation (DIC) technique. DIC measurements show inhomogeneous distribution of strain fields in the solder interconnections, and localization of strains predominantly near the interface(s). Creep experiments have also been performed at 373 K and 423 K and are compared to the shear loading experiments. SAC solder interconnections show the largest plastic deformation and the highest creep-resistance and exhibit fracture in ductile mode.

AB - Microstructural stability in eutectic Sn-3.8Ag-0.7Cu (SAC) solder has been investigated during isothermal annealing at 401 K or 454 K and cyclic annealing between 253 K to 401 K. Bulk Ag/sub 3/Sn and Cu/sub 6/Sn/sub 5/ intermetallics are found to be quite stable at these elevated temperatures. The distribution of local strain fields within SAC solder interconnections have been investigated under shear loading at ambient temperature by a digital image correlation (DIC) technique. DIC measurements show inhomogeneous distribution of strain fields in the solder interconnections, and localization of strains predominantly near the interface(s). Creep experiments have also been performed at 373 K and 423 K and are compared to the shear loading experiments. SAC solder interconnections show the largest plastic deformation and the highest creep-resistance and exhibit fracture in ductile mode.

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DO - 10.1109/ESIME.2004.1304060

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BT - Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium

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Matin MA, Vellinga WP, Geers MGD. Microstructural stability and failure modes in eutectic Sn-Ag-Cu solder. In Ernst LJ, Zhang GQ, Rodgers P, Saint Leger O, editors, Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium. Piscataway: Institute of Electrical and Electronics Engineers. 2004. p. 337-340 doi: 10.1109/ESIME.2004.1304060

Microstructural stability and failure modes in eutectic Sn-Ag-Cu solder

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