Microstructural stability and failure modes in eutectic Sn-Ag-Cu solder

M.A. Matin, W.P. Vellinga, M.G.D. Geers

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

2 Citations (Scopus)

Abstract

Microstructural stability in eutectic Sn-3.8Ag-0.7Cu (SAC) solder has been investigated during isothermal annealing at 401 K or 454 K and cyclic annealing between 253 K to 401 K. Bulk Ag/sub 3/Sn and Cu/sub 6/Sn/sub 5/ intermetallics are found to be quite stable at these elevated temperatures. The distribution of local strain fields within SAC solder interconnections have been investigated under shear loading at ambient temperature by a digital image correlation (DIC) technique. DIC measurements show inhomogeneous distribution of strain fields in the solder interconnections, and localization of strains predominantly near the interface(s). Creep experiments have also been performed at 373 K and 423 K and are compared to the shear loading experiments. SAC solder interconnections show the largest plastic deformation and the highest creep-resistance and exhibit fracture in ductile mode.
Original languageEnglish
Title of host publicationProceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium
EditorsL.J. Ernst, G.Q. Zhang, P. Rodgers, O Saint Leger
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Pages337-340
ISBN (Print)0-7803-8420-2
DOIs
Publication statusPublished - 2004

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