Microstructural evolution of solder joints subjected to thermomechanical loading

R.L.J.M. Ubachs, P.J.G. Schreurs, M.G.D. Geers

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Original languageEnglish
Title of host publicationProceedings CD of the 5th world congress on computational mechanics, Vienna, Austria, July 7-12, 2002
EditorsH.A. Mang, F.G. Rammerstorfer, J. Eberhardsteiner
Place of PublicationAustria
Publishers.n.
Pages1-8, www.tuwien.ac.a
ISBN (Print)3-9501554-0-6
Publication statusPublished - 2002

Cite this

Ubachs, R. L. J. M., Schreurs, P. J. G., & Geers, M. G. D. (2002). Microstructural evolution of solder joints subjected to thermomechanical loading. In H. A. Mang, F. G. Rammerstorfer, & J. Eberhardsteiner (Eds.), Proceedings CD of the 5th world congress on computational mechanics, Vienna, Austria, July 7-12, 2002 (pp. 1-8, www.tuwien.ac.a). s.n..