Microstructural evolution of solder joints subjected to thermomechanical loading

R.L.J.M. Ubachs, P.J.G. Schreurs, M.G.D. Geers

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	English
Title of host publication	Proceedings CD of the 5th world congress on computational mechanics, Vienna, Austria, July 7-12, 2002
Editors	H.A. Mang, F.G. Rammerstorfer, J. Eberhardsteiner
Place of Publication	Austria
Publisher	s.n.
Pages	1-8, www.tuwien.ac.a
ISBN (Print)	3-9501554-0-6
Publication status	Published - 2002

Cite this

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title = "Microstructural evolution of solder joints subjected to thermomechanical loading",

author = "R.L.J.M. Ubachs and P.J.G. Schreurs and M.G.D. Geers",

year = "2002",

language = "English",

isbn = "3-9501554-0-6",

pages = "1--8, www.tuwien.ac.a",

editor = "H.A. Mang and F.G. Rammerstorfer and J. Eberhardsteiner",

booktitle = "Proceedings CD of the 5th world congress on computational mechanics, Vienna, Austria, July 7-12, 2002",

publisher = "s.n.",

}

Microstructural evolution of solder joints subjected to thermomechanical loading. / Ubachs, R.L.J.M.; Schreurs, P.J.G.; Geers, M.G.D.
Proceedings CD of the 5th world congress on computational mechanics, Vienna, Austria, July 7-12, 2002. ed. / H.A. Mang; F.G. Rammerstorfer; J. Eberhardsteiner. Austria: s.n., 2002. p. 1-8, www.tuwien.ac.a.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Microstructural evolution of solder joints subjected to thermomechanical loading

AU - Ubachs, R.L.J.M.

AU - Schreurs, P.J.G.

AU - Geers, M.G.D.

PY - 2002

Y1 - 2002

M3 - Conference contribution

SN - 3-9501554-0-6

SP - 1-8, www.tuwien.ac.a

BT - Proceedings CD of the 5th world congress on computational mechanics, Vienna, Austria, July 7-12, 2002

A2 - Mang, H.A.

A2 - Rammerstorfer, F.G.

A2 - Eberhardsteiner, J.

PB - s.n.

CY - Austria

ER -