In solder joint reliability, solder/pad adjoining interface is crucial, the quality of which is determined by the metallization. In this paper, microstructural analyses of SnAgCu alloy and soldered joints are conducted in direct connection with the metallization. Solder balls, solder paste and cast SnAgCu are reflowed on Cu, Ni/Au and Cu/Ni(V)/Au. Substrate influence on bulk and interfacial metallurgy is examined and a correlation between interfacial microstructure and the corresponding damage paths is established. Damage localizes at the bonding interfaces with a strong influence of intermetallic layers and primary crystals. Crack propagation is studied with Cu and Ni/Au substrates and the cracking mechanism in principal directions is scrutinized. In BGA production, different reflow parameters are investigated, and an optimum bumping procedure is established. Nano-indentation is used for the mechanical characterization of the solder alloy. An assessment on indentation parameters for soft solders is conducted and the influence of Ag content on material properties of SnAgCu is presented.