Microstructural behaviour of solder alloys

R.L.J.M. Ubachs; P.J.G. Schreurs; M.G.D. Geers

doi:10.1109/ESIME.2004.1304089

Microstructural behaviour of solder alloys

R.L.J.M. Ubachs, P.J.G. Schreurs, M.G.D. Geers

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

2 Citations (Scopus)

1 Downloads (Pure)

Abstract

In this contribution a strongly nonlocal diffuse interface theory is used to model the microstructure evolution of a multiphase solder alloy. The mechanical behaviour of the material is modelled using a hyperelasto-viscoplastic Perzyna model. The material parameters are taken dependent on the mass fraction field which is calculated with the diffuse interface model. This results in a microstructure dependent material model which takes into account the size, orientation, and distribution of the individual phase regions.

Original language	English
Title of host publication	Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium
Editors	L.J. Ernst, G.Q. Zhang, P. Rodgers, O Saint Leger
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Pages	543-547
ISBN (Print)	0-7803-8420-2
DOIs	https://doi.org/10.1109/ESIME.2004.1304089
Publication status	Published - 2004

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Ubachs, R. L. J. M., Schreurs, P. J. G., & Geers, M. G. D. (2004). Microstructural behaviour of solder alloys. In L. J. Ernst, G. Q. Zhang, P. Rodgers, & O. Saint Leger (Eds.), Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium (pp. 543-547). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ESIME.2004.1304089

Ubachs, R.L.J.M. ; Schreurs, P.J.G. ; Geers, M.G.D. / Microstructural behaviour of solder alloys. Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium. editor / L.J. Ernst ; G.Q. Zhang ; P. Rodgers ; O Saint Leger. Piscataway : Institute of Electrical and Electronics Engineers, 2004. pp. 543-547

@inproceedings{dff0a484c6db41b28610fa4d92223c0b,

title = "Microstructural behaviour of solder alloys",

abstract = "In this contribution a strongly nonlocal diffuse interface theory is used to model the microstructure evolution of a multiphase solder alloy. The mechanical behaviour of the material is modelled using a hyperelasto-viscoplastic Perzyna model. The material parameters are taken dependent on the mass fraction field which is calculated with the diffuse interface model. This results in a microstructure dependent material model which takes into account the size, orientation, and distribution of the individual phase regions.",

author = "R.L.J.M. Ubachs and P.J.G. Schreurs and M.G.D. Geers",

year = "2004",

doi = "10.1109/ESIME.2004.1304089",

language = "English",

isbn = "0-7803-8420-2",

pages = "543--547",

editor = "L.J. Ernst and G.Q. Zhang and P. Rodgers and {Saint Leger}, O",

booktitle = "Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

}

Ubachs, RLJM, Schreurs, PJG & Geers, MGD 2004, Microstructural behaviour of solder alloys. in LJ Ernst, GQ Zhang, P Rodgers & O Saint Leger (eds), Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium. Institute of Electrical and Electronics Engineers, Piscataway, pp. 543-547. https://doi.org/10.1109/ESIME.2004.1304089

Microstructural behaviour of solder alloys. / Ubachs, R.L.J.M.; Schreurs, P.J.G.; Geers, M.G.D.

Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium. ed. / L.J. Ernst; G.Q. Zhang; P. Rodgers; O Saint Leger. Piscataway : Institute of Electrical and Electronics Engineers, 2004. p. 543-547.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Microstructural behaviour of solder alloys

AU - Ubachs, R.L.J.M.

AU - Schreurs, P.J.G.

AU - Geers, M.G.D.

PY - 2004

Y1 - 2004

N2 - In this contribution a strongly nonlocal diffuse interface theory is used to model the microstructure evolution of a multiphase solder alloy. The mechanical behaviour of the material is modelled using a hyperelasto-viscoplastic Perzyna model. The material parameters are taken dependent on the mass fraction field which is calculated with the diffuse interface model. This results in a microstructure dependent material model which takes into account the size, orientation, and distribution of the individual phase regions.

AB - In this contribution a strongly nonlocal diffuse interface theory is used to model the microstructure evolution of a multiphase solder alloy. The mechanical behaviour of the material is modelled using a hyperelasto-viscoplastic Perzyna model. The material parameters are taken dependent on the mass fraction field which is calculated with the diffuse interface model. This results in a microstructure dependent material model which takes into account the size, orientation, and distribution of the individual phase regions.

U2 - 10.1109/ESIME.2004.1304089

DO - 10.1109/ESIME.2004.1304089

M3 - Conference contribution

SN - 0-7803-8420-2

SP - 543

EP - 547

BT - Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium

A2 - Ernst, L.J.

A2 - Zhang, G.Q.

A2 - Rodgers, P.

A2 - Saint Leger, O

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

ER -

Ubachs RLJM, Schreurs PJG , Geers MGD. Microstructural behaviour of solder alloys. In Ernst LJ, Zhang GQ, Rodgers P, Saint Leger O, editors, Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium. Piscataway: Institute of Electrical and Electronics Engineers. 2004. p. 543-547 https://doi.org/10.1109/ESIME.2004.1304089