Microstructural behaviour of solder alloys

R.L.J.M. Ubachs, P.J.G. Schreurs, M.G.D. Geers

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

2 Citations (Scopus)
1 Downloads (Pure)

Abstract

In this contribution a strongly nonlocal diffuse interface theory is used to model the microstructure evolution of a multiphase solder alloy. The mechanical behaviour of the material is modelled using a hyperelasto-viscoplastic Perzyna model. The material parameters are taken dependent on the mass fraction field which is calculated with the diffuse interface model. This results in a microstructure dependent material model which takes into account the size, orientation, and distribution of the individual phase regions.
Original languageEnglish
Title of host publicationProceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium
EditorsL.J. Ernst, G.Q. Zhang, P. Rodgers, O Saint Leger
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Pages543-547
ISBN (Print)0-7803-8420-2
DOIs
Publication statusPublished - 2004

Fingerprint Dive into the research topics of 'Microstructural behaviour of solder alloys'. Together they form a unique fingerprint.

Cite this