Microstructural and mechanical characterization of 95.5Sn-4Ag-0.5Cu solder balls by nano-indentation

M.E. Erinc; P.J.G. Schreurs; G.Q. Zhang; W.D. van Driel; M.G.D. Geers

doi:10.1109/ESIME.2004.1304076

Microstructural and mechanical characterization of 95.5Sn-4Ag-0.5Cu solder balls by nano-indentation

M.E. Erinc, P.J.G. Schreurs, G.Q. Zhang, W.D. van Driel, M.G.D. Geers

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

1 Citation (Scopus)

Abstract

Elimination of Pb usage in electronic assemblies accelerates the research on lead-free solder alloys. The Sn-Ag-Cu (SAC) ternary system draws attention among other lead-free candidates due to its superior creep and fatigue strength and slow-coarsening behavior in its near-eutectic alloys. Previous studies show that solder connections exposed to thermo-mechanical loading exhibit weak interfaces. Particular attention needs to be paid to operative damage mechanisms at dendrite boundaries, colony boundaries and Cu-pad solder interface. Knowledge concerning damage mechanisms can be used later to predict reliability and life time of solder connections with the help of a numerical model. Such a model must incorporate the microstructure and simulate the initiation and evolution of damage. It can be used to design solder joints and microelectronic products/systems. This study concentrates on the material characterization of 95.5Sn-4.0Ag-0.5Cu solder balls. E-SEM is employed for the characterization of the initial microstructure. The nano-indentation technique is used to determine the mechanical properties of individual phases. Solder balls mounted on FR4 board are also examined to determine the interfacial behavior between the solder and copper pads

Original language	English
Title of host publication	Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium
Editors	L.J. Ernst, G.Q. Zhang, P. Rodgers, O Saint Leger
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Pages	443-448
ISBN (Print)	0-7803-8420-2
DOIs	https://doi.org/10.1109/ESIME.2004.1304076
Publication status	Published - 2004
Event	5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2004) - Brussels, Belgium Duration: 10 May 2004 → 12 May 2004

Conference

Conference	5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2004)
Abbreviated title	EuroSimE 2004
Country/Territory	Belgium
City	Brussels
Period	10/05/04 → 12/05/04

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10.1109/ESIME.2004.1304076

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Erinc, M. E., Schreurs, P. J. G., Zhang, G. Q., van Driel, W. D., & Geers, M. G. D. (2004). Microstructural and mechanical characterization of 95.5Sn-4Ag-0.5Cu solder balls by nano-indentation. In L. J. Ernst, G. Q. Zhang, P. Rodgers, & O. Saint Leger (Eds.), Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium (pp. 443-448). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ESIME.2004.1304076

Erinc, M.E. ; Schreurs, P.J.G. ; Zhang, G.Q. et al. / Microstructural and mechanical characterization of 95.5Sn-4Ag-0.5Cu solder balls by nano-indentation. Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium. editor / L.J. Ernst ; G.Q. Zhang ; P. Rodgers ; O Saint Leger. Piscataway : Institute of Electrical and Electronics Engineers, 2004. pp. 443-448

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title = "Microstructural and mechanical characterization of 95.5Sn-4Ag-0.5Cu solder balls by nano-indentation",

abstract = "Elimination of Pb usage in electronic assemblies accelerates the research on lead-free solder alloys. The Sn-Ag-Cu (SAC) ternary system draws attention among other lead-free candidates due to its superior creep and fatigue strength and slow-coarsening behavior in its near-eutectic alloys. Previous studies show that solder connections exposed to thermo-mechanical loading exhibit weak interfaces. Particular attention needs to be paid to operative damage mechanisms at dendrite boundaries, colony boundaries and Cu-pad solder interface. Knowledge concerning damage mechanisms can be used later to predict reliability and life time of solder connections with the help of a numerical model. Such a model must incorporate the microstructure and simulate the initiation and evolution of damage. It can be used to design solder joints and microelectronic products/systems. This study concentrates on the material characterization of 95.5Sn-4.0Ag-0.5Cu solder balls. E-SEM is employed for the characterization of the initial microstructure. The nano-indentation technique is used to determine the mechanical properties of individual phases. Solder balls mounted on FR4 board are also examined to determine the interfacial behavior between the solder and copper pads",

author = "M.E. Erinc and P.J.G. Schreurs and G.Q. Zhang and {van Driel}, W.D. and M.G.D. Geers",

year = "2004",

doi = "10.1109/ESIME.2004.1304076",

language = "English",

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publisher = "Institute of Electrical and Electronics Engineers",

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note = "5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2004), EuroSimE 2004 ; Conference date: 10-05-2004 Through 12-05-2004",

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Erinc, ME, Schreurs, PJG, Zhang, GQ, van Driel, WD & Geers, MGD 2004, Microstructural and mechanical characterization of 95.5Sn-4Ag-0.5Cu solder balls by nano-indentation. in LJ Ernst, GQ Zhang, P Rodgers & O Saint Leger (eds), Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium. Institute of Electrical and Electronics Engineers, Piscataway, pp. 443-448, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2004), Brussels, Belgium, 10/05/04. https://doi.org/10.1109/ESIME.2004.1304076

Microstructural and mechanical characterization of 95.5Sn-4Ag-0.5Cu solder balls by nano-indentation. / Erinc, M.E.; Schreurs, P.J.G.; Zhang, G.Q. et al.
Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium. ed. / L.J. Ernst; G.Q. Zhang; P. Rodgers; O Saint Leger. Piscataway: Institute of Electrical and Electronics Engineers, 2004. p. 443-448.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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T1 - Microstructural and mechanical characterization of 95.5Sn-4Ag-0.5Cu solder balls by nano-indentation

AU - Erinc, M.E.

AU - Schreurs, P.J.G.

AU - Zhang, G.Q.

AU - van Driel, W.D.

AU - Geers, M.G.D.

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N2 - Elimination of Pb usage in electronic assemblies accelerates the research on lead-free solder alloys. The Sn-Ag-Cu (SAC) ternary system draws attention among other lead-free candidates due to its superior creep and fatigue strength and slow-coarsening behavior in its near-eutectic alloys. Previous studies show that solder connections exposed to thermo-mechanical loading exhibit weak interfaces. Particular attention needs to be paid to operative damage mechanisms at dendrite boundaries, colony boundaries and Cu-pad solder interface. Knowledge concerning damage mechanisms can be used later to predict reliability and life time of solder connections with the help of a numerical model. Such a model must incorporate the microstructure and simulate the initiation and evolution of damage. It can be used to design solder joints and microelectronic products/systems. This study concentrates on the material characterization of 95.5Sn-4.0Ag-0.5Cu solder balls. E-SEM is employed for the characterization of the initial microstructure. The nano-indentation technique is used to determine the mechanical properties of individual phases. Solder balls mounted on FR4 board are also examined to determine the interfacial behavior between the solder and copper pads

AB - Elimination of Pb usage in electronic assemblies accelerates the research on lead-free solder alloys. The Sn-Ag-Cu (SAC) ternary system draws attention among other lead-free candidates due to its superior creep and fatigue strength and slow-coarsening behavior in its near-eutectic alloys. Previous studies show that solder connections exposed to thermo-mechanical loading exhibit weak interfaces. Particular attention needs to be paid to operative damage mechanisms at dendrite boundaries, colony boundaries and Cu-pad solder interface. Knowledge concerning damage mechanisms can be used later to predict reliability and life time of solder connections with the help of a numerical model. Such a model must incorporate the microstructure and simulate the initiation and evolution of damage. It can be used to design solder joints and microelectronic products/systems. This study concentrates on the material characterization of 95.5Sn-4.0Ag-0.5Cu solder balls. E-SEM is employed for the characterization of the initial microstructure. The nano-indentation technique is used to determine the mechanical properties of individual phases. Solder balls mounted on FR4 board are also examined to determine the interfacial behavior between the solder and copper pads

U2 - 10.1109/ESIME.2004.1304076

DO - 10.1109/ESIME.2004.1304076

M3 - Conference contribution

SN - 0-7803-8420-2

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EP - 448

BT - Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium

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A2 - Saint Leger, O

PB - Institute of Electrical and Electronics Engineers

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ER -

Erinc ME, Schreurs PJG, Zhang GQ, van Driel WD, Geers MGD. Microstructural and mechanical characterization of 95.5Sn-4Ag-0.5Cu solder balls by nano-indentation. In Ernst LJ, Zhang GQ, Rodgers P, Saint Leger O, editors, Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium. Piscataway: Institute of Electrical and Electronics Engineers. 2004. p. 443-448 doi: 10.1109/ESIME.2004.1304076

Microstructural and mechanical characterization of 95.5Sn-4Ag-0.5Cu solder balls by nano-indentation

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