Microstructural and mechanical characterization of 95.5Sn-4Ag-0.5Cu solder balls by nano-indentation

M.E. Erinc, P.J.G. Schreurs, G.Q. Zhang, W.D. van Driel, M.G.D. Geers

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

1 Citation (Scopus)

Abstract

Elimination of Pb usage in electronic assemblies accelerates the research on lead-free solder alloys. The Sn-Ag-Cu (SAC) ternary system draws attention among other lead-free candidates due to its superior creep and fatigue strength and slow-coarsening behavior in its near-eutectic alloys. Previous studies show that solder connections exposed to thermo-mechanical loading exhibit weak interfaces. Particular attention needs to be paid to operative damage mechanisms at dendrite boundaries, colony boundaries and Cu-pad solder interface. Knowledge concerning damage mechanisms can be used later to predict reliability and life time of solder connections with the help of a numerical model. Such a model must incorporate the microstructure and simulate the initiation and evolution of damage. It can be used to design solder joints and microelectronic products/systems. This study concentrates on the material characterization of 95.5Sn-4.0Ag-0.5Cu solder balls. E-SEM is employed for the characterization of the initial microstructure. The nano-indentation technique is used to determine the mechanical properties of individual phases. Solder balls mounted on FR4 board are also examined to determine the interfacial behavior between the solder and copper pads
Original languageEnglish
Title of host publicationProceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium
EditorsL.J. Ernst, G.Q. Zhang, P. Rodgers, O Saint Leger
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Pages443-448
ISBN (Print)0-7803-8420-2
DOIs
Publication statusPublished - 2004
Event5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2004) - Brussels, Belgium
Duration: 10 May 200412 May 2004

Conference

Conference5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2004)
Abbreviated titleEuroSimE 2004
CountryBelgium
CityBrussels
Period10/05/0412/05/04

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    Erinc, M. E., Schreurs, P. J. G., Zhang, G. Q., van Driel, W. D., & Geers, M. G. D. (2004). Microstructural and mechanical characterization of 95.5Sn-4Ag-0.5Cu solder balls by nano-indentation. In L. J. Ernst, G. Q. Zhang, P. Rodgers, & O. Saint Leger (Eds.), Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium (pp. 443-448). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ESIME.2004.1304076