Micron-scale experimental-numerical characterization of metal-polymer interface delamination in stretchable electronics interconnects

Understanding the mechanical behavior and failure mechanisms of stretchable electronics is key in developing reliable and long-lasting devices. In this work a micron-scale stretchable system consisting of an aluminum serpentine patterned interconnect adhered to a polyimide substrate is studied. In-situ experiments are performed where the stretchable sample is elongated, while the surface topography is measured using a confocal microscope. From the resulting height profiles the microscopic three-dimensional deformations are extracted using an adaptive isogeometric digital height correlation algorithm. The displacement information is compared to realistic numerical simulations, in which the interface behavior is described by cohesive zone elements. It is concluded that despite fitting the traction separation law parameters, the model fails to correctly capture the distinct out-of-plane buckling (with magnitude of a few micron) of the interconnect. The model is updated with residual stresses resulting from processing and crystal plasticity induced behavior (decreased yield strength) in the aluminum layer, but both measures are not resulting in the experimentally observed deformations. Finally, mixed-mode cohesive zones are implemented, in which the properties are different in the shear and normal direction. After fitting the corresponding parameters to the experimental data, the model shows realistic in-plane and out-of-plane deformations. Also a predictive simulation for a different geometry results in the correct experimentally measured behavior. It is concluded that the aluminum-polyimide interface mode-angle dependency explains the observed microscopic failure mode of local delamination and buckle formation.