Micromechanics of interface fracture in microelectronic devices: towards truly predictive multi-scale adhesion models

O. Sluis, van der

Micromechanics of interface fracture in microelectronic devices: towards truly predictive multi-scale adhesion models

O. Sluis, van der

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	English
Title of host publication	17th U.S. National Congress of Theoretical and Applied Mechanics, 15-20 June 2014, Michigan, USA
Place of Publication	Michigan
Publisher	Michigan State University
Publication status	Published - 2014
Event	17th U.S. National Congress of Theoretical and Applied Mechanics, June 15-20, 2014, East Lansing, Michigan, United States - Michigan State University, East Lansing, United States Duration: 15 Jun 2014 → 20 Jun 2014

Conference

Conference	17th U.S. National Congress of Theoretical and Applied Mechanics, June 15-20, 2014, East Lansing, Michigan, United States
Country/Territory	United States
City	East Lansing
Period	15/06/14 → 20/06/14

Cite this

@inproceedings{d06080efe4d049a4a90c197461a4b151,

title = "Micromechanics of interface fracture in microelectronic devices: towards truly predictive multi-scale adhesion models",

author = "\{Sluis, van der\}, O.",

year = "2014",

language = "English",

booktitle = "17th U.S. National Congress of Theoretical and Applied Mechanics, 15-20 June 2014, Michigan, USA",

publisher = "Michigan State University",

note = "17th U.S. National Congress of Theoretical and Applied Mechanics, June 15-20, 2014, East Lansing, Michigan, United States ; Conference date: 15-06-2014 Through 20-06-2014",

}

Sluis, van der, O 2014, Micromechanics of interface fracture in microelectronic devices: towards truly predictive multi-scale adhesion models. in 17th U.S. National Congress of Theoretical and Applied Mechanics, 15-20 June 2014, Michigan, USA. Michigan State University, Michigan, 17th U.S. National Congress of Theoretical and Applied Mechanics, June 15-20, 2014, East Lansing, Michigan, United States, East Lansing, Michigan, United States, 15/06/14.

Micromechanics of interface fracture in microelectronic devices: towards truly predictive multi-scale adhesion models. / Sluis, van der, O.
17th U.S. National Congress of Theoretical and Applied Mechanics, 15-20 June 2014, Michigan, USA. Michigan: Michigan State University, 2014.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Micromechanics of interface fracture in microelectronic devices: towards truly predictive multi-scale adhesion models

AU - Sluis, van der, O.

PY - 2014

Y1 - 2014

M3 - Conference contribution

BT - 17th U.S. National Congress of Theoretical and Applied Mechanics, 15-20 June 2014, Michigan, USA

PB - Michigan State University

CY - Michigan

T2 - 17th U.S. National Congress of Theoretical and Applied Mechanics, June 15-20, 2014, East Lansing, Michigan, United States

Y2 - 15 June 2014 through 20 June 2014

ER -