Microfabrication of 3D terahertz circuitry

C.M. Mann, P.J.I. de Maagt, G. McBride, A.M. Water, van de, D. Castiglione, A. McCalden, L. Deias, J. O'Neill, A. Laisne, J.T. Vallinas, I. Ederra, D. Haskett, D. Jenkins, A. Zinn, M. Ferlet, R. Edeson

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

7 Citations (Scopus)

Abstract

Advances in micro-fabrication techniques combined with accurate simulation tools has provided the means for the realisation of complex terahertz circuitry. Silicon micro-machining provides the way forward to fabricate accurate rugged structures. Multi-level deep reactive ion etching can be used to replace traditional machining methods achieving smaller feature size, improved surface finish and greater freedom in circuit layout. Photonic Bandgap waveguides enable three dimensional arrangements of active devices antennae and filters, and removes the requirement for metallisation of adjoining surfaces. This paper describes some of the state of the art terahertz circuit design and realisation using these techniques.
Original languageEnglish
Title of host publicationIEEE MTT-S International Microwave Symposium Digest, 2003
Place of PublicationPiscataway, USA
PublisherInstitute of Electrical and Electronics Engineers
Pages739-742
Number of pages4
Volume2
ISBN (Print)0-780376951
DOIs
Publication statusPublished - 2003

Fingerprint

Dive into the research topics of 'Microfabrication of 3D terahertz circuitry'. Together they form a unique fingerprint.

Cite this