Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques

V. Gonda, K.M.B. Jansen, L.J. Ernst, J.M.J. den Toonder, G.Q. Zhang

Research output: Contribution to journalArticleAcademicpeer-review

9 Citations (Scopus)

Abstract

Advanced micro-mechanical characterization methods provide material properties of thin films for modeling thermo-mechanical behavior of thin films for micro-electronic applications. Here, we focus on the local measurement method of nanoindentation for finding visco-elastic properties, and a global method of substrate curvature testing that provides linear elastic properties. Our specimen SiLK, Dow chemicals, is a low-k dielectric thin polymer film with a thickness of 400 nm, 6 and 8 µm, deposited on Si substrate. Our results show temperature dependent linear elastic and linear visco-elastic material properties for thin film materials.
Original languageEnglish
Pages (from-to)248-251
Number of pages4
JournalMicroelectronics and Reliability : an International Journal and World Abstracting Service
Volume47
Issue number2-3
DOIs
Publication statusPublished - 2007

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