Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques

V. Gonda, K.M.B. Jansen, L.J. Ernst, J.M.J. den Toonder, G.Q. Zhang

Research output: Contribution to journalArticleAcademicpeer-review

9 Citations (Scopus)

Abstract

Advanced micro-mechanical characterization methods provide material properties of thin films for modeling thermo-mechanical behavior of thin films for micro-electronic applications. Here, we focus on the local measurement method of nanoindentation for finding visco-elastic properties, and a global method of substrate curvature testing that provides linear elastic properties. Our specimen SiLK, Dow chemicals, is a low-k dielectric thin polymer film with a thickness of 400 nm, 6 and 8 µm, deposited on Si substrate. Our results show temperature dependent linear elastic and linear visco-elastic material properties for thin film materials.
Original languageEnglish
Pages (from-to)248-251
Number of pages4
JournalMicroelectronics and Reliability : an International Journal and World Abstracting Service
Volume47
Issue number2-3
DOIs
Publication statusPublished - 2007

Fingerprint

Mechanical testing
Nanoindentation
nanoindentation
curvature
Thin films
Substrates
thin films
elastic properties
Materials properties
microelectronics
Polymer films
Microelectronics
polymers
Testing
temperature
Temperature

Cite this

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title = "Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques",
abstract = "Advanced micro-mechanical characterization methods provide material properties of thin films for modeling thermo-mechanical behavior of thin films for micro-electronic applications. Here, we focus on the local measurement method of nanoindentation for finding visco-elastic properties, and a global method of substrate curvature testing that provides linear elastic properties. Our specimen SiLK, Dow chemicals, is a low-k dielectric thin polymer film with a thickness of 400 nm, 6 and 8 µm, deposited on Si substrate. Our results show temperature dependent linear elastic and linear visco-elastic material properties for thin film materials.",
author = "V. Gonda and K.M.B. Jansen and L.J. Ernst and {den Toonder}, J.M.J. and G.Q. Zhang",
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Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques. / Gonda, V.; Jansen, K.M.B.; Ernst, L.J.; den Toonder, J.M.J.; Zhang, G.Q.

In: Microelectronics and Reliability : an International Journal and World Abstracting Service, Vol. 47, No. 2-3, 2007, p. 248-251.

Research output: Contribution to journalArticleAcademicpeer-review

TY - JOUR

T1 - Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques

AU - Gonda, V.

AU - Jansen, K.M.B.

AU - Ernst, L.J.

AU - den Toonder, J.M.J.

AU - Zhang, G.Q.

PY - 2007

Y1 - 2007

N2 - Advanced micro-mechanical characterization methods provide material properties of thin films for modeling thermo-mechanical behavior of thin films for micro-electronic applications. Here, we focus on the local measurement method of nanoindentation for finding visco-elastic properties, and a global method of substrate curvature testing that provides linear elastic properties. Our specimen SiLK, Dow chemicals, is a low-k dielectric thin polymer film with a thickness of 400 nm, 6 and 8 µm, deposited on Si substrate. Our results show temperature dependent linear elastic and linear visco-elastic material properties for thin film materials.

AB - Advanced micro-mechanical characterization methods provide material properties of thin films for modeling thermo-mechanical behavior of thin films for micro-electronic applications. Here, we focus on the local measurement method of nanoindentation for finding visco-elastic properties, and a global method of substrate curvature testing that provides linear elastic properties. Our specimen SiLK, Dow chemicals, is a low-k dielectric thin polymer film with a thickness of 400 nm, 6 and 8 µm, deposited on Si substrate. Our results show temperature dependent linear elastic and linear visco-elastic material properties for thin film materials.

U2 - 10.1016/j.microrel.2006.09.033

DO - 10.1016/j.microrel.2006.09.033

M3 - Article

VL - 47

SP - 248

EP - 251

JO - Microelectronics Reliability

JF - Microelectronics Reliability

SN - 0026-2714

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