This paper describes three Ph.D. projects performed in the framework of the Tangram project , in which the Systems Engineering group (Dept. of Mechanical Engineering) from the Eindhoven University of Technology is involved. The Tangram project is a close cooperation between the Embedded Systems Institute (ESI) , ASML  and several academic partners. The project aims at a reduction of cost and lead time in the integration and test phases of complex high-tech products, such as ASML wafer scanners. Specifically, the aim is to reduce both the time to shipment and the test time at the customer’s site. The primary project objective is to define a test methodology with supporting processes and tools providing a right balance between product quality, product reliability, test schedule and test cost in order to optimize the return on investment.
|Number of pages||7|
|Publication status||Published - 2007|