Method of treating surfaces of substrates with the aid of a plasma and a reactor for carrying out the method

D.C. Schram; G.M.W. Kroesen

Method of treating surfaces of substrates with the aid of a plasma and a reactor for carrying out the method

D.C. Schram (Inventor), G.M.W. Kroesen (Inventor)

Plasma & Materials Processing

Research output: Patent › Patent publication

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Abstract

A method for treating substrate surfaces (e.g. etching and deposition) using a plasma. In practice the plasma flows from its source (13) to a treatment chamber (3). The plasma source is first flushed through with a flushing gas and when this has passed the cathodes (6), the reactant gas is fed into the plasma generator. The reactor used in this process is also described.

Original language	English
Publication status	Published - 1989

Bibliographical note

Patent EP0297637 (B1) 1989-01-04 ; US4871580 1989-10-03 ; NL8701530 1989-01-16 ; AT82460T 1992-11-15 ; AU596935 1990-05-17 ; AU1822288 1989-01-05 ; CA1324979 1993-12-07 ; DE3875815T 1993-04-29 ; ES2036253T 1993-05-16 ; GR3007016T 1993-07-30 ; JP1208450 1989-08-22 ; JP2705029B2 1998-01-26

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ep0297637 b1Final published version, 1.03 MB
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abstract = "A method for treating substrate surfaces (e.g. etching and deposition) using a plasma. In practice the plasma flows from its source (13) to a treatment chamber (3). The plasma source is first flushed through with a flushing gas and when this has passed the cathodes (6), the reactant gas is fed into the plasma generator. The reactor used in this process is also described.",

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language = "English",

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T1 - Method of treating surfaces of substrates with the aid of a plasma and a reactor for carrying out the method

AU - Schram, D.C.

AU - Kroesen, G.M.W.

N1 - Patent EP0297637 (B1) 1989-01-04 ; US4871580 1989-10-03 ; NL8701530 1989-01-16 ; AT82460T 1992-11-15 ; AU596935 1990-05-17 ; AU1822288 1989-01-05 ; CA1324979 1993-12-07 ; DE3875815T 1993-04-29 ; ES2036253T 1993-05-16 ; GR3007016T 1993-07-30 ; JP1208450 1989-08-22 ; JP2705029B2 1998-01-26

PY - 1989

Y1 - 1989

N2 - A method for treating substrate surfaces (e.g. etching and deposition) using a plasma. In practice the plasma flows from its source (13) to a treatment chamber (3). The plasma source is first flushed through with a flushing gas and when this has passed the cathodes (6), the reactant gas is fed into the plasma generator. The reactor used in this process is also described.

AB - A method for treating substrate surfaces (e.g. etching and deposition) using a plasma. In practice the plasma flows from its source (13) to a treatment chamber (3). The plasma source is first flushed through with a flushing gas and when this has passed the cathodes (6), the reactant gas is fed into the plasma generator. The reactor used in this process is also described.

M3 - Patent publication

ER -

Method of treating surfaces of substrates with the aid of a plasma and a reactor for carrying out the method

Abstract

Bibliographical note

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