Abstract
A method of plating via hole in a substrate includes providing a substrate having a first side and a second side and a plurality of through substrate via holes; depositing a first seed layer on the first side of the substrate; applying a foil on the first seed layer of the substrate closing the first ends of the plurality of via holes; electro-chemical plating of the second side of the substrate; and removing the foil
| Original language | English |
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| Patent number | US8455357 |
| Publication status | Published - 4 Jun 2013 |
| Externally published | Yes |