Method and system for forming a metallic structure

Method of forming a metallic structure (2) in a micro-machined recess that is provided in a surface of a semiconductor substrate (8). The method comprises positioning a protrusion (10) of an apparatus for depositing the metallic structure at least partly inside the recess, thus partly occupying the recess with the protrusion and defining in the recess a gap (14) along the protrusion. The method comprises driving a deposition fluid (20) through the gap in the recess along the protrusion. The method comprises growing in the gap the metallic structure by depositing metal ions contained by the deposition fluid. The method comprises moving the protrusion and the substrate relative to each other so that the protrusion, while being positioned in the recess, moves relative to the recess in a direction out of the recess, thus giving way for the growing of the metallic structure, and forming the metallic structure in the recess.