Mechanical failure prediction of copper/low-k dielectric interconnects using cohesive zone modeling

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	English
Title of host publication	Proceedings of 22nd Advanced Metallization Conference
Place of Publication	United States, Colorado Springs, Colorado
Publication status	Published - 2005

Cite this

Mechanical failure prediction of copper/low-k dielectric interconnects using cohesive zone modeling. / Hal, van, B.A.E.; Peerlings, R.H.J.; Zhang, G.Q.
Proceedings of 22nd Advanced Metallization Conference. United States, Colorado Springs, Colorado, 2005.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review