| Original language | English |
|---|---|
| Title of host publication | Proceedings of 22nd Advanced Metallization Conference |
| Place of Publication | United States, Colorado Springs, Colorado |
| Publication status | Published - 2005 |
Mechanical failure prediction of copper/low-k dielectric interconnects using cohesive zone modeling
B.A.E. Hal, van, R.H.J. Peerlings, G.Q. Zhang
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review