Mass transfer to and copper deposition on a round bar in a new type of electrolytic cell: the helix cell

L.J.J. Janssen, J.G. Wijers

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    Abstract

    High-rate electrodeposition of copper from CuSO4-H2SO4 baths can be achieved by using crossflow of solution. To obtain copper layers of uniform thickness and quality, a new type of electrolytic cell, the helix cell, has been proposed. An experimental dimensionless relation has been given to describe the mass transfer to a round bar, in crossflow, in a helix cell. Moreover, the current efficiency of copper deposition has been obtained as a function of current density, flow rate of solution, temperature and weight per cent CuSO4 in the CuSO4-H2SO4 solution.
    Original languageEnglish
    Pages (from-to)823-828
    JournalJournal of Applied Electrochemistry
    Volume19
    Issue number6
    DOIs
    Publication statusPublished - 1989

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