Abstract
Stacking voltage domains on top of each other is a design approach that is getting the attention of engineering communities due to the implicit high efficiency of the power delivery. Previous works have shown voltage stacking at the core level only. In this paper we present a more involved approach required to deploy voltage stacking not at the core level but at the IP level of a complex microcontroller. Our demonstrator chip features an ARM Cortex M0+ platform with an on-chip switched-capacitor voltage regulator. We chose to place the standard logic in one voltage domain between ground and VDD, and the memory "on top of it" between VDD and 2VDD, creating in this way a voltage stacked system. We further present silicon measurements that include a measured peak power efficiency in "stacked mode" of 96%.
Original language | English |
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Title of host publication | Proceedings of the 53rd Annual Design Automation Conference, DAC 2016, 5-9 June 2016, Austin, Texas |
Place of Publication | New York |
Publisher | Association for Computing Machinery, Inc |
Pages | 1-5 |
ISBN (Electronic) | 9781450342360 |
DOIs | |
Publication status | Published - 5 Jun 2016 |
Event | 53rd Annual ACM IEEE Design Automation Conference, DAC 2016 - Austin, United States Duration: 5 Jun 2016 → 9 Jun 2016 |
Conference
Conference | 53rd Annual ACM IEEE Design Automation Conference, DAC 2016 |
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Country/Territory | United States |
City | Austin |
Period | 5/06/16 → 9/06/16 |
Keywords
- Charge recycling
- Level shifter
- Low power design
- Microcontroller
- Stacked circuits
- Voltage regulator