Low temperature and roll-to-roll spatial Atomic Layer Deposition for flexible electronics

P. Poodt, R. Knaapen, A. Illiberi, F. Roozeboom, A. Asten, van

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Abstract

Spatial atomic layer deposition can be used as a high-throughput manufacturing technique in functional thin film deposition for applications such as flexible electronics. This; however, requires low-temperature processing and handling of flexible substrates. The authors investigate the process conditions under which low-temperature spatial atomic layer deposition of alumina from trimethyl aluminum and water is possible. The water partial pressure is the critical parameter in this case. Finally, our approach to roll-to-roll spatial atomic layer deposition is discussed.
Original languageEnglish
Article number01A142
Number of pages5
JournalJournal of Vacuum Science and Technology A: Vacuum, Surfaces, and Films
Volume30
Issue number1
DOIs
Publication statusPublished - 2012

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