Spatial atomic layer deposition can be used as a high-throughput manufacturing technique in functional thin film deposition for applications such as flexible electronics. This; however, requires low-temperature processing and handling of flexible substrates. The authors investigate the process conditions under which low-temperature spatial atomic layer deposition of alumina from trimethyl aluminum and water is possible. The water partial pressure is the critical parameter in this case. Finally, our approach to roll-to-roll spatial atomic layer deposition is discussed.