Wafer scale co-integration of the EICs to the PICs using the adhesion bonding technique can open up new opportunities for improved performance, power efficiency and manufacturability. Benzocyclobutene (BCB) polymer is an appropriate candidate for the bonding material owing to its adhesion quality, low dielectric constant and compatibility with Si and InP industries. In this paper, we present a low resistance metal interconnection technique in the wafer scale for carrying the high speed RF signals. The design concept is supported by measurements.
|Title of host publication||Proceedings of the 22nd Annual Symposium of the IEEE Photonics Society Benelux Chapter, November 27-28, 2017, Delft, Netherlands|
|Publication status||Published - 2017|
|Event||22nd Annual Symposium of the IEEE Photonics Society Benelux - Delft, Netherlands|
Duration: 27 Nov 2017 → 28 Nov 2017
Conference number: 22
|Conference||22nd Annual Symposium of the IEEE Photonics Society Benelux|
|Period||27/11/17 → 28/11/17|