LCT integration optimization on a printed circuit board technology, platform

E.C.W. de Jong; J.A. Ferreira; P. Bauer

doi:10.1109/IAS.2006.256788

LCT integration optimization on a printed circuit board technology, platform

E.C.W. de Jong, J.A. Ferreira, P. Bauer

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

2 Citations (Scopus)

Abstract

Prominent integration efforts, implementing various technologies and focusing on electromagnetic integration in the first place, have already been attempted in the past, with promising results. From a manufacturing point of view combining different technologies is a costly and complex process which also decreases the system reliability. The use of a single technology for integration therefore holds obvious advantages. An approach to realise an integrated resonant circuit completely in PCB technology is investigated. It is shown that electromagnetic and technology platform integration does not always go together. In this case, for the sake of low cost and manufacturability, technology integration goes first

Original language	English
Title of host publication	Conference Record of the 2006 IEEE Industry Applications Conference Forty-First IAS Annual Meeting
Publisher	Institute of Electrical and Electronics Engineers
Pages	1849-1856
Number of pages	8
ISBN (Print)	1-4244-0364-2
DOIs	https://doi.org/10.1109/IAS.2006.256788
Publication status	Published - 11 Dec 2006
Externally published	Yes
Event	2006 IEEE Industry Applications Conference Forty-First IAS Annual Meeting - Tampa, United States Duration: 8 Oct 2006 → 12 Oct 2006

Conference

Conference	2006 IEEE Industry Applications Conference Forty-First IAS Annual Meeting
Country/Territory	United States
City	Tampa
Period	8/10/06 → 12/10/06

Access to Document

10.1109/IAS.2006.256788

Cite this

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title = "LCT integration optimization on a printed circuit board technology, platform",

abstract = "Prominent integration efforts, implementing various technologies and focusing on electromagnetic integration in the first place, have already been attempted in the past, with promising results. From a manufacturing point of view combining different technologies is a costly and complex process which also decreases the system reliability. The use of a single technology for integration therefore holds obvious advantages. An approach to realise an integrated resonant circuit completely in PCB technology is investigated. It is shown that electromagnetic and technology platform integration does not always go together. In this case, for the sake of low cost and manufacturability, technology integration goes first",

author = "{de Jong}, E.C.W. and J.A. Ferreira and P. Bauer",

year = "2006",

month = dec,

day = "11",

doi = "10.1109/IAS.2006.256788",

language = "English",

isbn = "1-4244-0364-2",

pages = "1849--1856",

booktitle = "Conference Record of the 2006 IEEE Industry Applications Conference Forty-First IAS Annual Meeting",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "2006 IEEE Industry Applications Conference Forty-First IAS Annual Meeting ; Conference date: 08-10-2006 Through 12-10-2006",

}

de Jong, ECW, Ferreira, JA & Bauer, P 2006, LCT integration optimization on a printed circuit board technology, platform. in Conference Record of the 2006 IEEE Industry Applications Conference Forty-First IAS Annual Meeting. Institute of Electrical and Electronics Engineers, pp. 1849-1856, 2006 IEEE Industry Applications Conference Forty-First IAS Annual Meeting, Tampa, Florida, United States, 8/10/06. https://doi.org/10.1109/IAS.2006.256788

LCT integration optimization on a printed circuit board technology, platform. / de Jong, E.C.W.; Ferreira, J.A.; Bauer, P.
Conference Record of the 2006 IEEE Industry Applications Conference Forty-First IAS Annual Meeting. Institute of Electrical and Electronics Engineers, 2006. p. 1849-1856.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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N2 - Prominent integration efforts, implementing various technologies and focusing on electromagnetic integration in the first place, have already been attempted in the past, with promising results. From a manufacturing point of view combining different technologies is a costly and complex process which also decreases the system reliability. The use of a single technology for integration therefore holds obvious advantages. An approach to realise an integrated resonant circuit completely in PCB technology is investigated. It is shown that electromagnetic and technology platform integration does not always go together. In this case, for the sake of low cost and manufacturability, technology integration goes first

AB - Prominent integration efforts, implementing various technologies and focusing on electromagnetic integration in the first place, have already been attempted in the past, with promising results. From a manufacturing point of view combining different technologies is a costly and complex process which also decreases the system reliability. The use of a single technology for integration therefore holds obvious advantages. An approach to realise an integrated resonant circuit completely in PCB technology is investigated. It is shown that electromagnetic and technology platform integration does not always go together. In this case, for the sake of low cost and manufacturability, technology integration goes first

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M3 - Conference contribution

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BT - Conference Record of the 2006 IEEE Industry Applications Conference Forty-First IAS Annual Meeting

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ER -

LCT integration optimization on a printed circuit board technology, platform

Abstract

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