@inbook{e35f239853954c599bf325d1b348f9d1,
title = "Laser-assisted wafer processing: new perspectives in through-substrate via drilling and redistribution layer deposition",
keywords = "Direct-write deposition, Drilling, Laser drilling of TSVs, Laser-induced forward transfer, Laser-induced RDL deposition, Redistribution layers, Through-substrate vias, Wafer processing",
author = "M.B. Hoppenbrouwers and G. Oosterhuis and G. Knippels and F. Roozeboom",
year = "2014",
month = jul,
day = "21",
doi = "10.1002/9783527670109.ch08",
language = "English",
isbn = "9783527334667",
volume = "3",
pages = "121--134",
booktitle = "3D Process Technology",
publisher = "Wiley-Blackwell",
address = "United States",
}