Large-area spatial atomic layer deposition of amorphous oxide semiconductors at atmospheric pressure

  • IIias Katsouras
  • , Corné Frijters
  • , Paul Poodt
  • , Gerwin Gelinck
  • , Auke Jisk Kronemeijer

    Research output: Contribution to journalConference articlepeer-review

    Abstract

    Indium Gallium Zinc Oxide (IGZO) films are deposited using plasma-enhanced spatial Atomic Layer Deposition (sALD) on substrates as large as 32 cm x 35 cm. Excellent uniformity and thickness control leads to high-performing and stable co-planar top-gate self-aligned (SA) thin-film transistors (TFTs), demonstrating the viability of atmospheric spatial ALD as a novel deposition technique for the flat-panel display Industry.

    Original languageEnglish
    Pages (from-to)981-984
    Number of pages4
    JournalDigest of Technical Papers - SID International Symposium
    Volume50
    Issue number1
    DOIs
    Publication statusPublished - 1 Jan 2019
    EventSID Symposium, Seminar, and Exhibition 2019, Display Week 2019 - San Jose, United States
    Duration: 12 May 201917 May 2019

    Funding

    The authors would like to thank the process engineers of Hoist Centre's GEN1 R&D (TFT) Pilot Line for the fabrication of the TFT backplanes. This work was financed by the Flexlines project within the Interreg V-programme Flanders-The Netherlands, a cross-border cooperation programme with financial support from the European Regional Development Fund, and co-financed by the Province of Noord-Brabant, The Netherlands.

    Keywords

    • IGZO
    • Self-aligned TFT
    • Semiconductors
    • Spatial Atomic Layer Deposition
    • TFT Manufacturing

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