Investigation of horizontally aligned carbon nanotubes for efficient power delivery in 3D ICs

Aida Todri-Sanial

doi:10.1109/SaPIW.2014.6844535

Investigation of horizontally aligned carbon nanotubes for efficient power delivery in 3D ICs

Aida Todri-Sanial

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

5 Citations (Scopus)

Abstract

Carbon nanotubes (CNTs) due their unique mechanical, thermal, and electrical properties are being investigated as promising candidate material for on-chip and off-chip interconnects. The attractive mechanical properties of CNTs, including high Youngs modulus, resiliency and low thermal expansion coefficient offer great advantage for reliable and strong interconnects, and even more so for 3D integration. Through-Silicon-Vias (TSVs) enable 3D integration and implementation of denser, faster and heterogeneous circuits, which also lead to excessive power densities and elevated temperatures. Due to their unique properties, CNTs present an opportunity to address these challenges and provide solutions for reliable 3D integration. In this work, we perform detailed analyses of horizontally aligned CNTs and report on their efficiency to be exploited for 3D power delivery networks.

Original language	English
Title of host publication	2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings
Publisher	IEEE Computer Society
Number of pages	4
ISBN (Print)	9781479935994
DOIs	https://doi.org/10.1109/SaPIW.2014.6844535
Publication status	Published - 2014
Externally published	Yes
Event	18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Ghent, Belgium Duration: 11 May 2014 → 14 May 2014

Conference

Conference	18th IEEE Workshop on Signal and Power Integrity, SPI 2014
Country/Territory	Belgium
City	Ghent
Period	11/05/14 → 14/05/14

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10.1109/SaPIW.2014.6844535

Cite this

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title = "Investigation of horizontally aligned carbon nanotubes for efficient power delivery in 3D ICs",

abstract = "Carbon nanotubes (CNTs) due their unique mechanical, thermal, and electrical properties are being investigated as promising candidate material for on-chip and off-chip interconnects. The attractive mechanical properties of CNTs, including high Youngs modulus, resiliency and low thermal expansion coefficient offer great advantage for reliable and strong interconnects, and even more so for 3D integration. Through-Silicon-Vias (TSVs) enable 3D integration and implementation of denser, faster and heterogeneous circuits, which also lead to excessive power densities and elevated temperatures. Due to their unique properties, CNTs present an opportunity to address these challenges and provide solutions for reliable 3D integration. In this work, we perform detailed analyses of horizontally aligned CNTs and report on their efficiency to be exploited for 3D power delivery networks.",

author = "Aida Todri-Sanial",

year = "2014",

doi = "10.1109/SaPIW.2014.6844535",

language = "English",

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AU - Todri-Sanial, Aida

PY - 2014

Y1 - 2014

N2 - Carbon nanotubes (CNTs) due their unique mechanical, thermal, and electrical properties are being investigated as promising candidate material for on-chip and off-chip interconnects. The attractive mechanical properties of CNTs, including high Youngs modulus, resiliency and low thermal expansion coefficient offer great advantage for reliable and strong interconnects, and even more so for 3D integration. Through-Silicon-Vias (TSVs) enable 3D integration and implementation of denser, faster and heterogeneous circuits, which also lead to excessive power densities and elevated temperatures. Due to their unique properties, CNTs present an opportunity to address these challenges and provide solutions for reliable 3D integration. In this work, we perform detailed analyses of horizontally aligned CNTs and report on their efficiency to be exploited for 3D power delivery networks.

AB - Carbon nanotubes (CNTs) due their unique mechanical, thermal, and electrical properties are being investigated as promising candidate material for on-chip and off-chip interconnects. The attractive mechanical properties of CNTs, including high Youngs modulus, resiliency and low thermal expansion coefficient offer great advantage for reliable and strong interconnects, and even more so for 3D integration. Through-Silicon-Vias (TSVs) enable 3D integration and implementation of denser, faster and heterogeneous circuits, which also lead to excessive power densities and elevated temperatures. Due to their unique properties, CNTs present an opportunity to address these challenges and provide solutions for reliable 3D integration. In this work, we perform detailed analyses of horizontally aligned CNTs and report on their efficiency to be exploited for 3D power delivery networks.

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DO - 10.1109/SaPIW.2014.6844535

M3 - Conference contribution

AN - SCOPUS:84904480251

SN - 9781479935994

BT - 2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings

PB - IEEE Computer Society

T2 - 18th IEEE Workshop on Signal and Power Integrity, SPI 2014

Y2 - 11 May 2014 through 14 May 2014

ER -

Investigation of horizontally aligned carbon nanotubes for efficient power delivery in 3D ICs

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