Investigation of “fur-like” residues post dry etching of polyimide using aluminum hard etch mask

S. Joshi, A. Savov, S. Shafqat, R. Dekker

Research output: Contribution to journalArticleAcademicpeer-review

3 Citations (Scopus)
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Abstract

The authors found that oxygen plasma etching of polyimide (PI) with aluminum (Al) as a hard-etch mask results in lightly textured arbitrary shaped “fur-like” residues. Upon investigation, the presence of Al was detected in these residues. Ruling out several causes of metal contamination that were already reported in literature, a new theory for the presence of the metal containing residues is described. Furthermore, different methods for the residue free etching of PI using an Al hard-etch by using different metal deposition and patterning methods are explored. A fur-free procedure for the etching of PI using a one step-reactive ion etch of the metal hard-etch mask is presented.

Original languageEnglish
Pages (from-to)130-135
Number of pages6
JournalMaterials Science in Semiconductor Processing
Volume75
DOIs
Publication statusPublished - 1 Mar 2018

Keywords

  • PI residues
  • Polymers
  • Reactive ion etching
  • Residues
  • Sputtering

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