Interfacial adhesion method for semiconductor applications covering the full mode mixity

J. Thijsse, W.D. Driel, van, M.A.J. Gils, van, O. Sluis, van der

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

3 Citations (Scopus)

Abstract

Currently, prediction of interface strength is typically done using the critical energy release rate. Interface strength, however, is heavily dependent on mode mixity. Accurately predicting delamination therefore requires a material model that includes the mode dependency of interface strength. A novel test setup is designed which allows mixed mode delamination testing. The setup is a stabilized version of the mixed mode bending test previously described by Reeder and Crews (1990, 1991). It allows for the measurement of stable crack growth over the full range of mode mixities, using a single specimen design. The crack length, necessary for calculation of the energy release rate, is obtained from an analytical model. Crack length and displacement data are used in a finite element model containing a crack tip to calculate the mode mixity.
Original languageEnglish
Title of host publicationProceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2006), 24-26 April 2006, Como, Italy
PublisherInstitute of Electrical and Electronics Engineers
Pages1-5
ISBN (Print)1-4244-0275-1
DOIs
Publication statusPublished - 2006

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