Abstract
Interdiffusion reactions were studied in the systems Mo-Ni, Ti-Ni, Nb-Al, and Ti-Al. In the Ti-Ni system, the intermetallic compd. TiNi is interesting because of ductility at low temp. and its so-called shape-remembrance effect. The solid soln. of Ni in Ti grows very rapidly at >750 Deg and shows grain boundary diffusion. In the Nb-Al system no diffusion takes place below the Al m.p. At .apprx.635 Deg diffusion occurs, resulting in only 1 layer, viz. NbAl3. After removal of excess Al and heating at a higher temp., the compds. Nb3Al and Nb2Al are formed also. The phase diagram of the Ti-Al system is not yet completed, esp. concerning existence of the compd. Ti3Al. Diffusion below the Al m.p. results in growth of only the TiAl3 phase, the growth of which has a complicated course. [on SciFinder (R)]
| Original language | English |
|---|---|
| Pages (from-to) | 6-12 |
| Journal | Tijdschrift voor Oppervlakte Technieken van Metalen |
| Volume | 14 |
| Issue number | 1 |
| Publication status | Published - 1970 |