Interconnect and Architecture Planning: Global interconnect trade-off for technology over memory modules to application level: case study.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	English
Title of host publication	Proceedings of International Workshop on System-level interconnect prediction, April 2003
Publication status	Published - 2003

Cite this

@inproceedings{df9ad377f3f1414a83e1ac77cce168c5,

title = "Interconnect and Architecture Planning: Global interconnect trade-off for technology over memory modules to application level: case study.",

author = "A. Papanikolaou and M. Miranda and F. Catthoor and H. Corporaal and \{Man, de\}, H. and \{de Roest\}, D. and M. Stucchi and K. Maex",

year = "2003",

language = "English",

booktitle = "Proceedings of International Workshop on System-level interconnect prediction, April 2003",

}

Interconnect and Architecture Planning: Global interconnect trade-off for technology over memory modules to application level: case study. / Papanikolaou, A.; Miranda, M.; Catthoor, F. et al.
Proceedings of International Workshop on System-level interconnect prediction, April 2003. 2003.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Interconnect and Architecture Planning: Global interconnect trade-off for technology over memory modules to application level: case study.

AU - Papanikolaou, A.

AU - Miranda, M.

AU - Catthoor, F.

AU - Corporaal, H.

AU - Man, de, H.

AU - de Roest, D.

AU - Stucchi, M.

AU - Maex, K.

PY - 2003

Y1 - 2003

M3 - Conference contribution

BT - Proceedings of International Workshop on System-level interconnect prediction, April 2003

ER -