Interaction between EUV and construction materials

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Abstract

EUV scanners have been adopted worldwide for High-Volume Manufacturing (HVM) of sub-10nm lithography. The energetic photons and the ionization of the background gas by these photons result in a harsh environment for construction materials within the scanner. For application in upcoming EUV scanners, construction materials must be compatible with source powers of up to 1000 W, for >20 years of operation. This puts stringent requirements on the construction materials, manufacturing methods, cleaning and pretreatments. Besides effects of radiation and plasma, also surface charging risks must be considered, either from photoelectric effects or from ionization of the gas. In this paper, we will give an overview of the possible physical and chemical interactions between construction materials and photons and photon-induced plasma, and possible mitigations to prevent damage.

Original languageEnglish
Title of host publicationOptics Damage and Materials Processing by EUV/X-Ray Radiation (XDam9)
EditorsLibor Juha, Sasa Bajt, Stephane Guizard
PublisherSPIE
Number of pages5
ISBN (Electronic)9781510688629
DOIs
Publication statusPublished - 2025
EventOptics Damage and Materials Processing by EUV/X-Ray Radiation (XDam9) - Prague, Czech Republic
Duration: 7 Apr 20259 Apr 2025

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume13533
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceOptics Damage and Materials Processing by EUV/X-Ray Radiation (XDam9)
Country/TerritoryCzech Republic
CityPrague
Period7/04/259/04/25

Bibliographical note

Publisher Copyright:
© COPYRIGHT SPIE. Downloading of the abstract is permitted for personal use only.

Keywords

  • EUV
  • EUV-induced plasma
  • Plasma-assisted discharge
  • X-ray

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