Integration trends in monolithic power ICs: Application and technology challenges

M. Rose, H.J. Bergveld

Research output: Contribution to journalArticleAcademicpeer-review

10 Citations (Scopus)

Abstract

This paper highlights the general trend towards further monolithic integration in power applications by enabling power management and interfacing solutions in advanced CMOS nodes. The need to combine high-density digital circuits, power-management circuits, and robust interfaces in a single technology platform requires the development of additional process options on top of baseline CMOS. Examples include high-voltage devices, devices to enable area-efficient ESD protection, and integrated capacitors and inductors with high quality factors. The use of bipolar devices in these technologies for protection and control purposes in power applications is also addressed.

Original languageEnglish
Article number7480762
Pages (from-to)1965-1974
Number of pages10
JournalIEEE Journal of Solid-State Circuits
Volume51
Issue number9
DOIs
Publication statusPublished - 1 Sep 2016

Keywords

  • BCD technology
  • CMOS technology
  • DC/DC converter
  • ESD protection
  • high-voltage devices
  • integrated passives
  • interfaces
  • monolithic integration
  • power management

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