Integration trends in monolithic power ICs: Application and technology challenges

This paper highlights the general trend towards further monolithic integration in power applications by enabling power management and interfacing solutions in advanced CMOS nodes. The need to combine high-density digital circuits, power-management circuits, and robust interfaces in a single technology platform requires the development of additional process options on top of baseline CMOS. Examples include high-voltage devices, devices to enable area-efficient ESD protection, and integrated capacitors and inductors with high quality factors. The use of bipolar devices in these technologies for protection and control purposes in power applications is also addressed.