Integration of photodetectors with lasers for optical interconnects using 200 mm waferscale III-V/SOI technoloy

T. Spuesens; L. Liu; D. Vermeulen; J. Zhao; P. Rojo Romeo; P. Regreny; L. Grenouillet; J.-M. Fédéli; D. Thourhout, Van

Integration of photodetectors with lasers for optical interconnects using 200 mm waferscale III-V/SOI technoloy

T. Spuesens, L. Liu, D. Vermeulen, J. Zhao, P. Rojo Romeo, P. Regreny, L. Grenouillet, J.-M. Fédéli, D. Thourhout, Van

Photonic Integration

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

3 Downloads (Pure)

Abstract

We demonstrate efficient photodetectors on top of a laser epitaxial structure completely fabricated using 200 mm wafer scale III-V/SOI technology enabling very dense integration of lasers and detectors for optical interconnect circuits.

Original language	English
Title of host publication	Proceedings of the Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC), 6-10 March 2011, Los Angeles, California, USA
Pages	JThA27-1/3
Publication status	Published - 2011
Event	2011 Optical Fiber Communication Conference (OFC 2011) - Los Angeles Convention Center, Los Angeles, United States Duration: 6 Mar 2011 → 10 Mar 2011

Conference

Conference	2011 Optical Fiber Communication Conference (OFC 2011)
Abbreviated title	OFC 2011
Country/Territory	United States
City	Los Angeles
Period	6/03/11 → 10/03/11
Other	OFC/NFOEC 2011

Cite this

Spuesens, T., Liu, L., Vermeulen, D., Zhao, J., Rojo Romeo, P., Regreny, P., Grenouillet, L., Fédéli, J-M., & Thourhout, Van, D. (2011). Integration of photodetectors with lasers for optical interconnects using 200 mm waferscale III-V/SOI technoloy. In Proceedings of the Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC), 6-10 March 2011, Los Angeles, California, USA (pp. JThA27-1/3)

@inproceedings{cb9370712fd34ccf81487e3e06e0a978,

title = "Integration of photodetectors with lasers for optical interconnects using 200 mm waferscale III-V/SOI technoloy",

abstract = "We demonstrate efficient photodetectors on top of a laser epitaxial structure completely fabricated using 200 mm wafer scale III-V/SOI technology enabling very dense integration of lasers and detectors for optical interconnect circuits.",

author = "T. Spuesens and L. Liu and D. Vermeulen and J. Zhao and {Rojo Romeo}, P. and P. Regreny and L. Grenouillet and J.-M. F{\'e}d{\'e}li and {Thourhout, Van}, D.",

year = "2011",

language = "English",

pages = "JThA27--1/3",

booktitle = "Proceedings of the Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC), 6-10 March 2011, Los Angeles, California, USA",

note = "2011 Optical Fiber Communication Conference (OFC 2011), OFC 2011 ; Conference date: 06-03-2011 Through 10-03-2011",

}

Spuesens, T, Liu, L, Vermeulen, D, Zhao, J, Rojo Romeo, P, Regreny, P, Grenouillet, L, Fédéli, J-M & Thourhout, Van, D 2011, Integration of photodetectors with lasers for optical interconnects using 200 mm waferscale III-V/SOI technoloy. in Proceedings of the Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC), 6-10 March 2011, Los Angeles, California, USA. pp. JThA27-1/3, 2011 Optical Fiber Communication Conference (OFC 2011), Los Angeles, California, United States, 6/03/11.

Integration of photodetectors with lasers for optical interconnects using 200 mm waferscale III-V/SOI technoloy. / Spuesens, T.; Liu, L.; Vermeulen, D. et al.
Proceedings of the Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC), 6-10 March 2011, Los Angeles, California, USA. 2011. p. JThA27-1/3.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Integration of photodetectors with lasers for optical interconnects using 200 mm waferscale III-V/SOI technoloy

AU - Spuesens, T.

AU - Liu, L.

AU - Vermeulen, D.

AU - Zhao, J.

AU - Rojo Romeo, P.

AU - Regreny, P.

AU - Grenouillet, L.

AU - Fédéli, J.-M.

AU - Thourhout, Van, D.

PY - 2011

Y1 - 2011

N2 - We demonstrate efficient photodetectors on top of a laser epitaxial structure completely fabricated using 200 mm wafer scale III-V/SOI technology enabling very dense integration of lasers and detectors for optical interconnect circuits.

AB - We demonstrate efficient photodetectors on top of a laser epitaxial structure completely fabricated using 200 mm wafer scale III-V/SOI technology enabling very dense integration of lasers and detectors for optical interconnect circuits.

M3 - Conference contribution

SP - JThA27-1/3

BT - Proceedings of the Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC), 6-10 March 2011, Los Angeles, California, USA

T2 - 2011 Optical Fiber Communication Conference (OFC 2011)

Y2 - 6 March 2011 through 10 March 2011

ER -

Spuesens T, Liu L, Vermeulen D, Zhao J, Rojo Romeo P, Regreny P et al. Integration of photodetectors with lasers for optical interconnects using 200 mm waferscale III-V/SOI technoloy. In Proceedings of the Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC), 6-10 March 2011, Los Angeles, California, USA. 2011. p. JThA27-1/3

Integration of photodetectors with lasers for optical interconnects using 200 mm waferscale III-V/SOI technoloy

Abstract

Conference

Fingerprint

Cite this