Integration and test planning of embedded systems is a task often performed by industry experts. The reason for this is the multi-disciplinary nature of the embedded system, the complexity of the components and their environment and the volatility of the integration and test plan. The Tangram research project aims at reducing the integration and test duration of complex embedded systems, like ASML wafer scanners, without influencing the product quality or cost. Integration and test planning is one of the areas where model-based techniques and algorithms can reduce the integration and test duration. This paper presents a structured integration and test planning method including several improvement cycles. This method is applicable for multi-disciplinary systems and can be used to guide the modeling and optimization effort of industrial-size integration and test plans. This method has been used as a framework for our research into integration and test modeling, sequencing, planning and optimization.
|Title of host publication||Tangram: Model-based integration and testing of complex high-tech systems|
|Place of Publication||Eindhoven|
|Publisher||Embedded Systems Institute|
|Publication status||Published - 2007|