Integrating advanced interconnect technologies in a high power lighting application : first steps

S.P.M. Noijen; S. Fritsche; A.S. Klein; A. Poppe; G Kums; O. Sluis, van der

doi:10.1109/THERMINIC.2013.6675209

Integrating advanced interconnect technologies in a high power lighting application : first steps

S.P.M. Noijen
, S. Fritsche
, A.S. Klein
, A. Poppe
, G Kums
, O. Sluis, van der

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic

2 Citations (Scopus)

Abstract

This paper reports on first results towards the development of a high power lighting demonstrator of the FP7 Nanotherm project. The demonstrator aims to show an optimized ROHS compliant interconnect solution. Hereto sintered materials are considered as alternative interconnect materials. Additionally, a heat spreader concept is evaluated as alternative for state-of-the-art IMS boards. This paper shows preliminary results for: - Transient thermal measurements of the reference system. - First trials of sintered past and adhesive used to mount LEDs on DCB substrates. - Thermal finite element simulations of the heatspreader concept compared to the IMS solution.

Original language	English
Title of host publication	Proceedings of the 19th International Workshop on Thermal Investigations of ICs and Systems (Therminic 2013), Berlin, 25-27 September, 2013
Publisher	Institute of Electrical and Electronics Engineers
Pages	276-280
ISBN (Print)	978-1-4799-2271-0
DOIs	https://doi.org/10.1109/THERMINIC.2013.6675209
Publication status	Published - 2013
Event	19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013 - Berlin, Germany Duration: 25 Sept 2013 → 27 Sept 2013

Conference

Conference	19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013
Abbreviated title	THERMINIC 2013
Country/Territory	Germany
City	Berlin
Period	25/09/13 → 27/09/13

Access to Document

10.1109/THERMINIC.2013.6675209

Cite this

Noijen, S. P. M., Fritsche, S., Klein, A. S., Poppe, A., Kums, G., & Sluis, van der, O. (2013). Integrating advanced interconnect technologies in a high power lighting application : first steps. In Proceedings of the 19th International Workshop on Thermal Investigations of ICs and Systems (Therminic 2013), Berlin, 25-27 September, 2013 (pp. 276-280). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/THERMINIC.2013.6675209

@inproceedings{a06ff32cb72d4f6d9a8a0b73883ce581,

title = "Integrating advanced interconnect technologies in a high power lighting application : first steps",

abstract = "This paper reports on first results towards the development of a high power lighting demonstrator of the FP7 Nanotherm project. The demonstrator aims to show an optimized ROHS compliant interconnect solution. Hereto sintered materials are considered as alternative interconnect materials. Additionally, a heat spreader concept is evaluated as alternative for state-of-the-art IMS boards. This paper shows preliminary results for: - Transient thermal measurements of the reference system. - First trials of sintered past and adhesive used to mount LEDs on DCB substrates. - Thermal finite element simulations of the heatspreader concept compared to the IMS solution.",

author = "S.P.M. Noijen and S. Fritsche and A.S. Klein and A. Poppe and G Kums and \{Sluis, van der\}, O.",

year = "2013",

doi = "10.1109/THERMINIC.2013.6675209",

language = "English",

isbn = "978-1-4799-2271-0",

pages = "276--280",

booktitle = "Proceedings of the 19th International Workshop on Thermal Investigations of ICs and Systems (Therminic 2013), Berlin, 25-27 September, 2013",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013, THERMINIC 2013 ; Conference date: 25-09-2013 Through 27-09-2013",

}

Noijen, SPM, Fritsche, S, Klein, AS, Poppe, A, Kums, G & Sluis, van der, O 2013, Integrating advanced interconnect technologies in a high power lighting application : first steps. in Proceedings of the 19th International Workshop on Thermal Investigations of ICs and Systems (Therminic 2013), Berlin, 25-27 September, 2013. Institute of Electrical and Electronics Engineers, pp. 276-280, 19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013, Berlin, Germany, 25/09/13. https://doi.org/10.1109/THERMINIC.2013.6675209

Integrating advanced interconnect technologies in a high power lighting application : first steps. / Noijen, S.P.M.; Fritsche, S.; Klein, A.S. et al.
Proceedings of the 19th International Workshop on Thermal Investigations of ICs and Systems (Therminic 2013), Berlin, 25-27 September, 2013. Institute of Electrical and Electronics Engineers, 2013. p. 276-280.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic

TY - GEN

T1 - Integrating advanced interconnect technologies in a high power lighting application : first steps

AU - Noijen, S.P.M.

AU - Fritsche, S.

AU - Klein, A.S.

AU - Poppe, A.

AU - Kums, G

AU - Sluis, van der, O.

PY - 2013

Y1 - 2013

N2 - This paper reports on first results towards the development of a high power lighting demonstrator of the FP7 Nanotherm project. The demonstrator aims to show an optimized ROHS compliant interconnect solution. Hereto sintered materials are considered as alternative interconnect materials. Additionally, a heat spreader concept is evaluated as alternative for state-of-the-art IMS boards. This paper shows preliminary results for: - Transient thermal measurements of the reference system. - First trials of sintered past and adhesive used to mount LEDs on DCB substrates. - Thermal finite element simulations of the heatspreader concept compared to the IMS solution.

AB - This paper reports on first results towards the development of a high power lighting demonstrator of the FP7 Nanotherm project. The demonstrator aims to show an optimized ROHS compliant interconnect solution. Hereto sintered materials are considered as alternative interconnect materials. Additionally, a heat spreader concept is evaluated as alternative for state-of-the-art IMS boards. This paper shows preliminary results for: - Transient thermal measurements of the reference system. - First trials of sintered past and adhesive used to mount LEDs on DCB substrates. - Thermal finite element simulations of the heatspreader concept compared to the IMS solution.

U2 - 10.1109/THERMINIC.2013.6675209

DO - 10.1109/THERMINIC.2013.6675209

M3 - Conference contribution

SN - 978-1-4799-2271-0

SP - 276

EP - 280

BT - Proceedings of the 19th International Workshop on Thermal Investigations of ICs and Systems (Therminic 2013), Berlin, 25-27 September, 2013

PB - Institute of Electrical and Electronics Engineers

T2 - 19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013

Y2 - 25 September 2013 through 27 September 2013

ER -

Noijen SPM, Fritsche S, Klein AS, Poppe A, Kums G, Sluis, van der O. Integrating advanced interconnect technologies in a high power lighting application : first steps. In Proceedings of the 19th International Workshop on Thermal Investigations of ICs and Systems (Therminic 2013), Berlin, 25-27 September, 2013. Institute of Electrical and Electronics Engineers. 2013. p. 276-280 doi: 10.1109/THERMINIC.2013.6675209

Integrating advanced interconnect technologies in a high power lighting application : first steps

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