Integrating advanced interconnect technologies in a high power lighting application : first steps

S.P.M. Noijen, S. Fritsche, A.S. Klein, A. Poppe, G Kums, O. Sluis, van der

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

1 Citation (Scopus)

Abstract

This paper reports on first results towards the development of a high power lighting demonstrator of the FP7 Nanotherm project. The demonstrator aims to show an optimized ROHS compliant interconnect solution. Hereto sintered materials are considered as alternative interconnect materials. Additionally, a heat spreader concept is evaluated as alternative for state-of-the-art IMS boards. This paper shows preliminary results for: - Transient thermal measurements of the reference system. - First trials of sintered past and adhesive used to mount LEDs on DCB substrates. - Thermal finite element simulations of the heatspreader concept compared to the IMS solution.
Original languageEnglish
Title of host publicationProceedings of the 19th International Workshop on Thermal Investigations of ICs and Systems (Therminic 2013), Berlin, 25-27 September, 2013
PublisherInstitute of Electrical and Electronics Engineers
Pages276-280
ISBN (Print)978-1-4799-2271-0
DOIs
Publication statusPublished - 2013
Eventconference; the 19th International Workshop on Thermal Investigations of ICs and Systems (Therminic 2013); 2013-09-25; 2013-09-27 -
Duration: 25 Sep 201327 Sep 2013

Conference

Conferenceconference; the 19th International Workshop on Thermal Investigations of ICs and Systems (Therminic 2013); 2013-09-25; 2013-09-27
Abbreviated titleTherminic2013
Period25/09/1327/09/13
Otherthe 19th International Workshop on Thermal Investigations of ICs and Systems (Therminic 2013)

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    Noijen, S. P. M., Fritsche, S., Klein, A. S., Poppe, A., Kums, G., & Sluis, van der, O. (2013). Integrating advanced interconnect technologies in a high power lighting application : first steps. In Proceedings of the 19th International Workshop on Thermal Investigations of ICs and Systems (Therminic 2013), Berlin, 25-27 September, 2013 (pp. 276-280). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/THERMINIC.2013.6675209