Integrated multi-pixel near-infrared spectral sensor

Kaylee D. Hakkel; Maurangelo Petruzzella; Francesco Pagliano; Anne van Klinken; Tianran Liu; P.J. van Veldhoven; Andrea Fiore

doi:10.1364/AIS.2020.ATu3I.3

Integrated multi-pixel near-infrared spectral sensor

Kaylee D. Hakkel, Maurangelo Petruzzella, Francesco Pagliano, Anne van Klinken, Tianran Liu, P.J. van Veldhoven, Andrea Fiore

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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Abstract

An integrated semiconductor spectral sensor is demonstrated. It is based on an array of resonant- cavity-enhanced photodetectors covering the short-wavelength infrared region. Its robustness and small footprint make this device suitable for on-site spectral sensing applications.

Original language	English
Title of host publication	Proceedings of Applied Industrial Spectroscopy 2020 Washington, DC United States 22–26 June 2020
Publisher	Optical Society of America (OSA)
Number of pages	2
ISBN (Electronic)	978-1-943580-78-1
DOIs	https://doi.org/10.1364/AIS.2020.ATu3I.3
Publication status	Published - 22 Jun 2020
Event	Applied Industrial Spectroscopy 2020 - Washington, United States Duration: 22 Jun 2020 → 26 Jun 2020

Conference

Conference	Applied Industrial Spectroscopy 2020
Country/Territory	United States
City	Washington
Period	22/06/20 → 26/06/20

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10.1364/AIS.2020.ATu3I.3

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@inproceedings{2c95e0640aa64c7ea5ad8be6dbb40372,

title = "Integrated multi-pixel near-infrared spectral sensor",

abstract = "An integrated semiconductor spectral sensor is demonstrated. It is based on an array of resonant- cavity-enhanced photodetectors covering the short-wavelength infrared region. Its robustness and small footprint make this device suitable for on-site spectral sensing applications.",

author = "Hakkel, {Kaylee D.} and Maurangelo Petruzzella and Francesco Pagliano and {van Klinken}, Anne and Tianran Liu and {van Veldhoven}, P.J. and Andrea Fiore",

year = "2020",

month = jun,

day = "22",

doi = "10.1364/AIS.2020.ATu3I.3",

language = "English",

booktitle = "Proceedings of Applied Industrial Spectroscopy 2020 Washington, DC United States 22–26 June 2020",

publisher = "Optical Society of America (OSA)",

address = "United States",

note = "Applied Industrial Spectroscopy 2020<br/> ; Conference date: 22-06-2020 Through 26-06-2020",

}

Hakkel, KD , Petruzzella, M , Pagliano, F , van Klinken, A , Liu, T, van Veldhoven, PJ & Fiore, A 2020, Integrated multi-pixel near-infrared spectral sensor. in Proceedings of Applied Industrial Spectroscopy 2020 Washington, DC United States 22–26 June 2020., ATu3I.3, Optical Society of America (OSA), Applied Industrial Spectroscopy 2020
, Washington, United States, 22/06/20. https://doi.org/10.1364/AIS.2020.ATu3I.3

Integrated multi-pixel near-infrared spectral sensor. / Hakkel, Kaylee D.; Petruzzella, Maurangelo ; Pagliano, Francesco ; van Klinken, Anne ; Liu, Tianran; van Veldhoven, P.J.; Fiore, Andrea.

Proceedings of Applied Industrial Spectroscopy 2020 Washington, DC United States 22–26 June 2020. Optical Society of America (OSA), 2020. ATu3I.3.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Integrated multi-pixel near-infrared spectral sensor

AU - Hakkel, Kaylee D.

AU - Petruzzella, Maurangelo

AU - Pagliano, Francesco

AU - van Klinken, Anne

AU - Liu, Tianran

AU - van Veldhoven, P.J.

AU - Fiore, Andrea

PY - 2020/6/22

Y1 - 2020/6/22

N2 - An integrated semiconductor spectral sensor is demonstrated. It is based on an array of resonant- cavity-enhanced photodetectors covering the short-wavelength infrared region. Its robustness and small footprint make this device suitable for on-site spectral sensing applications.

AB - An integrated semiconductor spectral sensor is demonstrated. It is based on an array of resonant- cavity-enhanced photodetectors covering the short-wavelength infrared region. Its robustness and small footprint make this device suitable for on-site spectral sensing applications.

U2 - 10.1364/AIS.2020.ATu3I.3

DO - 10.1364/AIS.2020.ATu3I.3

M3 - Conference contribution

BT - Proceedings of Applied Industrial Spectroscopy 2020 Washington, DC United States 22–26 June 2020

PB - Optical Society of America (OSA)

T2 - Applied Industrial Spectroscopy 2020<br/>

Y2 - 22 June 2020 through 26 June 2020

ER -

Integrated multi-pixel near-infrared spectral sensor

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