Integrated microwave photonics for 5G

Chris Roeloffzen; Ilka Visscher; Caterina Taddei; Dimitri Geskus; Ruud Oldenbeuving; Jorn Epping; Roelof Bernardus Timens; Paul van Dijk; Rene Heideman; Marcel Hoekman; Robert Grootjans; Laurens Bliek; Sander Wahls; Michel Verhaegen

Integrated microwave photonics for 5G

Chris Roeloffzen
, Ilka Visscher
, Caterina Taddei
, Dimitri Geskus
, Ruud Oldenbeuving
, Jorn Epping
, Roelof Bernardus Timens
, Paul van Dijk
, Rene Heideman
, Marcel Hoekman
, Robert Grootjans
, Laurens Bliek
, Sander Wahls
, Michel Verhaegen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Abstract

This paper describes the design, fabrication, packaging, testing and automated tuning of an integrated 1x4 optical beamforming network. It consists of hybridly integrated InP and TriPleX chips, where end-facet coupling is used for optical interfacing.

Original language	English
Title of host publication	2018 Conference on Lasers and Electro-Optics (CLEO)
Publisher	Institute of Electrical and Electronics Engineers
Chapter	JTh3D.2.p
Number of pages	2
ISBN (Electronic)	978-1-943580-42-2
Publication status	Published - 9 Aug 2018
Externally published	Yes
Event	2018 Conference on Lasers and Electro-Optics (CLEO 2018) - San Jose, United States Duration: 13 May 2018 → 18 May 2018 https://www.cleoconference.org/home/

Conference

Conference	2018 Conference on Lasers and Electro-Optics (CLEO 2018)
Abbreviated title	CLEO 2018
Country/Territory	United States
City	San Jose
Period	13/05/18 → 18/05/18
Internet address	https://www.cleoconference.org/home/

Access to Document

https://ieeexplore.ieee.org/document/8427052

Cite this

Roeloffzen, C., Visscher, I., Taddei, C., Geskus, D., Oldenbeuving, R., Epping, J., Timens, R. B., van Dijk, P., Heideman, R., Hoekman, M., Grootjans, R., Bliek, L., Wahls, S., & Verhaegen, M. (2018). Integrated microwave photonics for 5G. In 2018 Conference on Lasers and Electro-Optics (CLEO) Article 8427052 Institute of Electrical and Electronics Engineers. https://ieeexplore.ieee.org/document/8427052

@inproceedings{9a8b46ecfdd44ca0823e04c3e90ca8ca,

title = "Integrated microwave photonics for 5G",

abstract = "This paper describes the design, fabrication, packaging, testing and automated tuning of an integrated 1x4 optical beamforming network. It consists of hybridly integrated InP and TriPleX chips, where end-facet coupling is used for optical interfacing.",

author = "Chris Roeloffzen and Ilka Visscher and Caterina Taddei and Dimitri Geskus and Ruud Oldenbeuving and Jorn Epping and Timens, \{Roelof Bernardus\} and \{van Dijk\}, Paul and Rene Heideman and Marcel Hoekman and Robert Grootjans and Laurens Bliek and Sander Wahls and Michel Verhaegen",

year = "2018",

month = aug,

day = "9",

language = "English",

booktitle = "2018 Conference on Lasers and Electro-Optics (CLEO)",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "2018 Conference on Lasers and Electro-Optics (CLEO 2018), CLEO 2018 ; Conference date: 13-05-2018 Through 18-05-2018",

url = "https://www.cleoconference.org/home/",

}

Roeloffzen, C, Visscher, I, Taddei, C, Geskus, D, Oldenbeuving, R, Epping, J, Timens, RB, van Dijk, P, Heideman, R, Hoekman, M, Grootjans, R, Bliek, L, Wahls, S & Verhaegen, M 2018, Integrated microwave photonics for 5G. in 2018 Conference on Lasers and Electro-Optics (CLEO)., 8427052, Institute of Electrical and Electronics Engineers, 2018 Conference on Lasers and Electro-Optics (CLEO 2018), San Jose, California, United States, 13/05/18. <https://ieeexplore.ieee.org/document/8427052>

TY - GEN

T1 - Integrated microwave photonics for 5G

AU - Roeloffzen, Chris

AU - Visscher, Ilka

AU - Taddei, Caterina

AU - Geskus, Dimitri

AU - Oldenbeuving, Ruud

AU - Epping, Jorn

AU - Timens, Roelof Bernardus

AU - van Dijk, Paul

AU - Heideman, Rene

AU - Hoekman, Marcel

AU - Grootjans, Robert

AU - Bliek, Laurens

AU - Wahls, Sander

AU - Verhaegen, Michel

PY - 2018/8/9

Y1 - 2018/8/9

N2 - This paper describes the design, fabrication, packaging, testing and automated tuning of an integrated 1x4 optical beamforming network. It consists of hybridly integrated InP and TriPleX chips, where end-facet coupling is used for optical interfacing.

AB - This paper describes the design, fabrication, packaging, testing and automated tuning of an integrated 1x4 optical beamforming network. It consists of hybridly integrated InP and TriPleX chips, where end-facet coupling is used for optical interfacing.

UR - https://www.scopus.com/pages/publications/85052577744

M3 - Conference contribution

BT - 2018 Conference on Lasers and Electro-Optics (CLEO)

PB - Institute of Electrical and Electronics Engineers

T2 - 2018 Conference on Lasers and Electro-Optics (CLEO 2018)

Y2 - 13 May 2018 through 18 May 2018

ER -

Integrated microwave photonics for 5G

Abstract

Conference

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