Optical interconnection technologies are increasingly deployed in high-performance electronic systems to address challenges in connectivity, size, bandwidth, latency, and cost. Projected performance requirements are leading to formidable cost and energy efficiency challenges. Hybrid and integrated photonic technologies are currently being developed to reduce assembly complexity and to reduce the numbers of individually packaged parts. This chapter provides an overview of the important challenges that photonics currently face, identifies the various optical technologies that are being considered for use at the different interconnection levels, and presents examples of demonstrated state-of-the-art optical interconnection systems. Finally, the prospects and potential of these technologies in the near future are discussed.
|Title of host publication||Optical fiber telecommunications VIA : components and subsystems|
|Editors||I.P. Kaminov, T. Li, A.E. Willner|
|Number of pages||800|
|Publication status||Published - 2013|