Abstract
We developed an InP-based photodetector which was bonded on a CMOS wafer containing a Si3N4-wiring photonic circuit. The detector fabrication is compatible with wafer scale processing steps, guaranteeing compatibility towards future generation electronic IC processing. Integration technology and experimental results are presented in this paper. © 2009 IEEE.
Original language | English |
---|---|
Title of host publication | Proceedings of the 2009 IEEE LEOS Annual Meeting Conference, (LEOS '09) 4 - 8 October 2009, Belek-Antalya |
Place of Publication | Piscataway |
Publisher | Institute of Electrical and Electronics Engineers |
Pages | TuB2-139/140 |
ISBN (Print) | 978-1-4244-3680-4 |
DOIs | |
Publication status | Published - 2009 |
Event | 22nd Annual Meeting of the IEEE Photonics Society (LEOS 2009) - Antalya, Turkey Duration: 4 Oct 2009 → 8 Oct 2009 Conference number: 22 |
Conference
Conference | 22nd Annual Meeting of the IEEE Photonics Society (LEOS 2009) |
---|---|
Abbreviated title | LEOS 2009 |
Country/Territory | Turkey |
City | Antalya |
Period | 4/10/09 → 8/10/09 |