Inferred measurement of subsurface nanosheet structures using scanning probe microscopy, solving the inverse problem

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8 Downloads (Pure)

Abstract

Metrology challenges surrounding nanosheet structures used in next generation semiconductor devices based around Forksheet and Gate-All-around Field Effect Transistors include procuring measurements in the planar directions, such as critical dimensions, as well as in the vertical direction, such as sheet and recess thicknesses. Subsurface Scanning Probe Microscopy (SSPM) can be used to distinguish and measure features that are buried beneath opaque layers. In this work, we investigate if SSPM can contribute to this challenge and can be used to solve the inverse problem. It is shown that qualitative agreement between modelling and experiments is good, when the experimental contact conditions are sufficient. Quantitative measurements, however, are still out of reach.
Original languageEnglish
Title of host publicationMetrology, Inspection, and Process Control XXXVI
EditorsJohn C. Robinson, Matthew J. Sendelbach
PublisherSPIE
Pages120530M-1-120530M-9
Number of pages9
ISBN (Electronic)978151064982
ISBN (Print)9781510649811
DOIs
Publication statusPublished - 2022
EventSPIE Advanced Lithography + Patterning 2022 - San Jose, United States
Duration: 24 Apr 202230 May 2022

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume12053
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceSPIE Advanced Lithography + Patterning 2022
Country/TerritoryUnited States
CitySan Jose
Period24/04/2230/05/22

Keywords

  • Nanosheet
  • Scanning Probe Microscopy
  • Subsurface

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