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Industrial high-rate (~ 5 nm/s) deposited silicon nitride yielding high-quality bulk and surface passivation under optimum anti-reflection coating conditions

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Abstract

High-quality surface and bulk passivation of crystalline silicon solar cells has been obtained under optimum anti-reflection coating properties by silicon nitride (a-SiNx:H) deposited at very high deposition rates of 5 nm/s. These a-SiNx:H films were deposited using the expanding thermal plasma (ETP) technology under regular processing conditions in an inline industrial-type reactor with a nominal throughput of 960 solar cells/hour. The low surface recombination velocities (50-70 cm/s) were obtained on p-type silicon substrates (8·4 cm resistivity) for as-deposited and annealed films within the broad refractive index range of 1·9-2·4, which covers the optimum bulk passivation and anti-reflection coating performance reached at a refractive index of 2·1.
Original languageEnglish
Pages (from-to)705-712
JournalProgress in Photovoltaics: Research and Applications
Volume13
Issue number8
DOIs
Publication statusPublished - 2005

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