In-situ EMC testing using surface current sense wires

M.J. Coenen, T. Maas, Yili Hu, A.H.M. Roermund, van

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Abstract

In-situ EMC testing is, for large fixed systems and installations within the scope of the European EMC Directive, not a primary requirement other than unintended RF emissions may not affect intended radio frequency communication services, like the requirements of IEC/EN 55011 outside the end-user's premises. Whatever happens on the premises of the industrial end-user is a matter of negotiations and agreements between the various system suppliers and the end-user, in particular when EMC is lacking between two or more (sub-) systems installed. A formal standardized method for verification is IEC CISPR/TR 16-2-5 Ed. 1.0, but one of the root problems is the usage of common EMC measurement antenna nearby a conductive object, when performing in-situ EMC investigations, which remains doubtful. In a pan-European TEMCA-2 (ended 2007) project several investigations have been carried out which have not (yet) resulted in a standardized test method but their results have been reported at several international symposia. In this paper, part of an adapted in-situ measurement approach is presented which minimizes the interaction with the local EM-environment even further by using surface current sense wires. This new test method has already been submitted as NP to the international standardization bodies concerned.
Original languageEnglish
Title of host publicationProceedings of the 2010 Asia-PacificSymposium on Electromagnetic Compatibility ( APEMC), April 12-16, Beijing, China
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Pages586-589
ISBN (Print)978-1-4244-5621-5
DOIs
Publication statusPublished - 2010

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    Coenen, M. J., Maas, T., Hu, Y., & Roermund, van, A. H. M. (2010). In-situ EMC testing using surface current sense wires. In Proceedings of the 2010 Asia-PacificSymposium on Electromagnetic Compatibility ( APEMC), April 12-16, Beijing, China (pp. 586-589). Piscataway: Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/APEMC.2010.5475752