Thermal management plays a pivotal role in achieving high power densities in converters. By incorporating integration technologies into, and on, the PCB structure, improvement in power density and thermal performance of critical components are achieved without the addition of extra, expensive material. Better use of the already available PCB copper, layout and packaging technology is utilised to gain the advantages proposed. Theory to evaluate the thermal management efficiency is applied to a case study flyback converter that has been geometrically integrated and thermally revised. The improvement of the thermal management efficiency in conjunction with a geometrical integration process forms the core of the paper, validated by experimental measurements.
|Title of host publication||Conference Record of the 2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting|
|Publisher||Institute of Electrical and Electronics Engineers|
|Publication status||Published - 1 Nov 2004|
|Event||2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting - Seattle, United States|
Duration: 3 Oct 2004 → 7 Oct 2004
|Conference||2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting|
|Period||3/10/04 → 7/10/04|