Improving the thermal management of AC-DC converters using integration technologies

E.C.W. de Jong; J. A. Ferreira; P. Bauer

doi:10.1109/IAS.2004.1348798

Improving the thermal management of AC-DC converters using integration technologies

E.C.W. de Jong, J. A. Ferreira, P. Bauer

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

10 Citations (Scopus)

Abstract

Thermal management plays a pivotal role in achieving high power densities in converters. By incorporating integration technologies into, and on, the PCB structure, improvement in power density and thermal performance of critical components are achieved without the addition of extra, expensive material. Better use of the already available PCB copper, layout and packaging technology is utilised to gain the advantages proposed. Theory to evaluate the thermal management efficiency is applied to a case study flyback converter that has been geometrically integrated and thermally revised. The improvement of the thermal management efficiency in conjunction with a geometrical integration process forms the core of the paper, validated by experimental measurements.

Original language	English
Title of host publication	Conference Record of the 2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting
Publisher	Institute of Electrical and Electronics Engineers
Pages	2315-2322
ISBN (Print)	0-7803-8486-5
DOIs	https://doi.org/10.1109/IAS.2004.1348798
Publication status	Published - 1 Nov 2004
Externally published	Yes
Event	2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting - Seattle, United States Duration: 3 Oct 2004 → 7 Oct 2004

Conference

Conference	2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting
Country/Territory	United States
City	Seattle
Period	3/10/04 → 7/10/04

Access to Document

10.1109/IAS.2004.1348798

Cite this

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title = "Improving the thermal management of AC-DC converters using integration technologies",

abstract = "Thermal management plays a pivotal role in achieving high power densities in converters. By incorporating integration technologies into, and on, the PCB structure, improvement in power density and thermal performance of critical components are achieved without the addition of extra, expensive material. Better use of the already available PCB copper, layout and packaging technology is utilised to gain the advantages proposed. Theory to evaluate the thermal management efficiency is applied to a case study flyback converter that has been geometrically integrated and thermally revised. The improvement of the thermal management efficiency in conjunction with a geometrical integration process forms the core of the paper, validated by experimental measurements.",

author = "{de Jong}, E.C.W. and Ferreira, {J. A.} and P. Bauer",

year = "2004",

month = nov,

day = "1",

doi = "10.1109/IAS.2004.1348798",

language = "English",

isbn = "0-7803-8486-5",

pages = "2315--2322",

booktitle = "Conference Record of the 2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting ; Conference date: 03-10-2004 Through 07-10-2004",

}

de Jong, ECW, Ferreira, JA & Bauer, P 2004, Improving the thermal management of AC-DC converters using integration technologies. in Conference Record of the 2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting. Institute of Electrical and Electronics Engineers, pp. 2315-2322, 2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting, Seattle, Washington, United States, 3/10/04. https://doi.org/10.1109/IAS.2004.1348798

Improving the thermal management of AC-DC converters using integration technologies. / de Jong, E.C.W.; Ferreira, J. A.; Bauer, P.
Conference Record of the 2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting. Institute of Electrical and Electronics Engineers, 2004. p. 2315-2322.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Improving the thermal management of AC-DC converters using integration technologies

AU - de Jong, E.C.W.

AU - Ferreira, J. A.

AU - Bauer, P.

PY - 2004/11/1

Y1 - 2004/11/1

N2 - Thermal management plays a pivotal role in achieving high power densities in converters. By incorporating integration technologies into, and on, the PCB structure, improvement in power density and thermal performance of critical components are achieved without the addition of extra, expensive material. Better use of the already available PCB copper, layout and packaging technology is utilised to gain the advantages proposed. Theory to evaluate the thermal management efficiency is applied to a case study flyback converter that has been geometrically integrated and thermally revised. The improvement of the thermal management efficiency in conjunction with a geometrical integration process forms the core of the paper, validated by experimental measurements.

AB - Thermal management plays a pivotal role in achieving high power densities in converters. By incorporating integration technologies into, and on, the PCB structure, improvement in power density and thermal performance of critical components are achieved without the addition of extra, expensive material. Better use of the already available PCB copper, layout and packaging technology is utilised to gain the advantages proposed. Theory to evaluate the thermal management efficiency is applied to a case study flyback converter that has been geometrically integrated and thermally revised. The improvement of the thermal management efficiency in conjunction with a geometrical integration process forms the core of the paper, validated by experimental measurements.

U2 - 10.1109/IAS.2004.1348798

DO - 10.1109/IAS.2004.1348798

M3 - Conference contribution

SN - 0-7803-8486-5

SP - 2315

EP - 2322

BT - Conference Record of the 2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting

PB - Institute of Electrical and Electronics Engineers

T2 - 2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting

Y2 - 3 October 2004 through 7 October 2004

ER -

Improving the thermal management of AC-DC converters using integration technologies

Abstract

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