If integrated circuit substrates are characterized from a propagative perspective, one can see that parameters such as the source current density distribution or the relative orientation between source and victim, also play a role in substrate coupling. In this paper, we analyze how different current distribution patterns excite interference propagation modes, in terms of matching and orientation. In addition, we analyze the current density footprint of some potential on-chip substrate interference sources in order to describe their contribution to substrate coupling from this perspective, providing additional insight on their effectiveness exciting interference modes.
|Title of host publication||2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, 4-7 September 2017, Angers, France|
|Place of Publication||Piscataway|
|Publisher||Institute of Electrical and Electronics Engineers|
|Publication status||Published - 2 Nov 2017|