Impact of 3D design choices on manufacturing cost

D. Velenis, M. Stucchi, E.J. Marinissen, B. Swinnen, E. Beyne

Research output: Chapter in Book/Report/Conference proceedingChapterAcademicpeer-review

87 Citations (Scopus)
151 Downloads (Pure)

Abstract


The available options in 3D IC design and manufacturing have different impact on the cost of a 3D System-on-Chip. Using the 3D cost model developed at IMEC, the cost of different system integration options is analyzed and the cost effectiveness of different technology solutions is demonstrated. The cost model is based on the IMEC 3D integration process flows and includes the cost of manufacturing equipment, fabrication facilities, personnel, and materials. Using the IMEC 3D cost model, the cost of various 3D stacking strategies is compared to single die (i.e. 2D) integration. In addition, the effect on cost of different Through-Silicon-Via (TSV) manufacturing technologies is evaluated. The effectiveness of different 3D testing strategies and their impact on system cost is also investigated.
Original languageEnglish
Title of host publication2009 IEEE International Conference on 3D System Integration
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Pages146-150
Number of pages5
ISBN (Print)978-1-4244-4511-0
DOIs
Publication statusPublished - Sept 2009
Externally publishedYes
Event2009 IEEE International Conference on 3D System Integration (3DIC 2009) - San Francisco, United States
Duration: 28 Sept 200930 Sept 2009

Conference

Conference2009 IEEE International Conference on 3D System Integration (3DIC 2009)
Abbreviated title3DIC 2009
Country/TerritoryUnited States
CitySan Francisco
Period28/09/0930/09/09

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