Image-based interface characterization with a restricted microscopic field of view

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Abstract

Accurate characterization of adhesion properties in microelectronic systems is challenging due to (1) the far-field load application that often falls outside the microscopic field of view, (2) the ultra-small loads associated with specimen deformation, and (3) the load-case and specimen dependent interface response. To overcome these challenges, a generic method based on Integrated Digital Image Correlation (IDIC) is proposed, which identifies cohesive zone model parameters (of an arbitrary model not intrinsic to the identification method), by correlating images of a delaSavemination process from a restricted field of view at the microscopic scale, whereby far-field loading data cannot be exploited.To quantify the effects of potential error sources on the performance of the proposed IDIC-routine, virtual experimentation is first conducted. Inaccurate application of boundary conditions in the FE-model of IDIC is thereby shown to be the most critical source of error. Subsequently, a real double cantilever beam (DCB) experiment has been analyzed as a well-defined test-case for characterization of adhesion properties. Since the Young's modulus of the bulk material is generally well known, the imaged, elastically deforming bulk material acts as a force sensor. External load measurement can therefore be omitted from the identification process, thereby rendering the interface identification method independent of the particular test method. The implemented IDIC-algorithm is shown to be robust for accurately identifying the two cohesive zone parameters of interest: the work of separation Gc and the critical opening displacement δc

Original languageEnglish
Pages (from-to)218-231
Number of pages14
JournalInternational Journal of Solids and Structures
Volume132-133
DOIs
Publication statusPublished - Feb 2018

Fingerprint

Digital Image
Field of View
field of view
Adhesion
Far Field
Cantilever beams
far fields
Cohesive Zone
Cohesive Zone Model
Force Sensor
Microelectronics
adhesion
Cantilever Beam
Identification (control systems)
Young's Modulus
Inaccurate
Elastic moduli
Boundary conditions
Rendering
Experimentation

Keywords

  • Adhesion properties
  • Cohesive zone model
  • Digital image correlation
  • Finite element model
  • Full-field identification
  • Integrated digital image correlation
  • Interface characterization
  • Inverse methods
  • Microelectronics

Cite this

@article{be6663a21aa54d16a4a1c10be235d536,
title = "Image-based interface characterization with a restricted microscopic field of view",
abstract = "Accurate characterization of adhesion properties in microelectronic systems is challenging due to (1) the far-field load application that often falls outside the microscopic field of view, (2) the ultra-small loads associated with specimen deformation, and (3) the load-case and specimen dependent interface response. To overcome these challenges, a generic method based on Integrated Digital Image Correlation (IDIC) is proposed, which identifies cohesive zone model parameters (of an arbitrary model not intrinsic to the identification method), by correlating images of a delaSavemination process from a restricted field of view at the microscopic scale, whereby far-field loading data cannot be exploited.To quantify the effects of potential error sources on the performance of the proposed IDIC-routine, virtual experimentation is first conducted. Inaccurate application of boundary conditions in the FE-model of IDIC is thereby shown to be the most critical source of error. Subsequently, a real double cantilever beam (DCB) experiment has been analyzed as a well-defined test-case for characterization of adhesion properties. Since the Young's modulus of the bulk material is generally well known, the imaged, elastically deforming bulk material acts as a force sensor. External load measurement can therefore be omitted from the identification process, thereby rendering the interface identification method independent of the particular test method. The implemented IDIC-algorithm is shown to be robust for accurately identifying the two cohesive zone parameters of interest: the work of separation Gc and the critical opening displacement δc",
keywords = "Adhesion properties, Cohesive zone model, Digital image correlation, Finite element model, Full-field identification, Integrated digital image correlation, Interface characterization, Inverse methods, Microelectronics",
author = "A.P. Ruybalid and J.P.M. Hoefnagels and {van der Sluis}, O. and M.G.D. Geers",
year = "2018",
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language = "English",
volume = "132-133",
pages = "218--231",
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}

Image-based interface characterization with a restricted microscopic field of view. / Ruybalid, A.P.; Hoefnagels, J.P.M.; van der Sluis, O.; Geers, M.G.D.

In: International Journal of Solids and Structures, Vol. 132-133, 02.2018, p. 218-231.

Research output: Contribution to journalArticleAcademicpeer-review

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T1 - Image-based interface characterization with a restricted microscopic field of view

AU - Ruybalid, A.P.

AU - Hoefnagels, J.P.M.

AU - van der Sluis, O.

AU - Geers, M.G.D.

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N2 - Accurate characterization of adhesion properties in microelectronic systems is challenging due to (1) the far-field load application that often falls outside the microscopic field of view, (2) the ultra-small loads associated with specimen deformation, and (3) the load-case and specimen dependent interface response. To overcome these challenges, a generic method based on Integrated Digital Image Correlation (IDIC) is proposed, which identifies cohesive zone model parameters (of an arbitrary model not intrinsic to the identification method), by correlating images of a delaSavemination process from a restricted field of view at the microscopic scale, whereby far-field loading data cannot be exploited.To quantify the effects of potential error sources on the performance of the proposed IDIC-routine, virtual experimentation is first conducted. Inaccurate application of boundary conditions in the FE-model of IDIC is thereby shown to be the most critical source of error. Subsequently, a real double cantilever beam (DCB) experiment has been analyzed as a well-defined test-case for characterization of adhesion properties. Since the Young's modulus of the bulk material is generally well known, the imaged, elastically deforming bulk material acts as a force sensor. External load measurement can therefore be omitted from the identification process, thereby rendering the interface identification method independent of the particular test method. The implemented IDIC-algorithm is shown to be robust for accurately identifying the two cohesive zone parameters of interest: the work of separation Gc and the critical opening displacement δc

AB - Accurate characterization of adhesion properties in microelectronic systems is challenging due to (1) the far-field load application that often falls outside the microscopic field of view, (2) the ultra-small loads associated with specimen deformation, and (3) the load-case and specimen dependent interface response. To overcome these challenges, a generic method based on Integrated Digital Image Correlation (IDIC) is proposed, which identifies cohesive zone model parameters (of an arbitrary model not intrinsic to the identification method), by correlating images of a delaSavemination process from a restricted field of view at the microscopic scale, whereby far-field loading data cannot be exploited.To quantify the effects of potential error sources on the performance of the proposed IDIC-routine, virtual experimentation is first conducted. Inaccurate application of boundary conditions in the FE-model of IDIC is thereby shown to be the most critical source of error. Subsequently, a real double cantilever beam (DCB) experiment has been analyzed as a well-defined test-case for characterization of adhesion properties. Since the Young's modulus of the bulk material is generally well known, the imaged, elastically deforming bulk material acts as a force sensor. External load measurement can therefore be omitted from the identification process, thereby rendering the interface identification method independent of the particular test method. The implemented IDIC-algorithm is shown to be robust for accurately identifying the two cohesive zone parameters of interest: the work of separation Gc and the critical opening displacement δc

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JO - International Journal of Solids and Structures

JF - International Journal of Solids and Structures

SN - 0020-7683

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