III-V/Silicon first order distributed feedback lasers integrated on SOI waveguide circuits

S. Keyvaninia; S. Verstuyft; L. Landschoot, van; D. Thourhout, Van; G.C. Roelkens; G.-H. Duan; F. Lelarge; J.M. Fedeli; S. Messaoudene; T. Vries, de; E.J. Geluk; E. Smalbrugge; M.K. Smit

doi:10.1049/cp.2013.1306

III-V/Silicon first order distributed feedback lasers integrated on SOI waveguide circuits

S. Keyvaninia, S. Verstuyft, L. Landschoot, van, D. Thourhout, Van, G.C. Roelkens, G.-H. Duan, F. Lelarge, J.M. Fedeli, S. Messaoudene, T. Vries, de, E.J. Geluk, E. Smalbrugge, M.K. Smit

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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Abstract

Heterogeneously integrated III-V-on-silicon first order distributed feedback lasers utilizing an ultra-thin DVS-BCB die-to-wafer bonding process are reported. A novel design exploiting high confinement in the active waveguide is demonstrated. 5 mW output power coupled to a silicon waveguide, 40 dB side mode suppression ratio and continuous wave operation up to 60°C is obtained.

Original language	English
Title of host publication	Proceedings of the 39th European Conference and Exhibition on Optical Communication (ECOC 2013), 22-26 September 2013, London, United Kingdom
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Pages	Mo.4.B.3-1/4
DOIs	https://doi.org/10.1049/cp.2013.1306
Publication status	Published - 2013
Event	39th European Conference and Exhibition on Optical Communication (ECOC 2013) - London, United Kingdom Duration: 22 Sept 2013 → 26 Sept 2013 Conference number: 39

Conference

Conference	39th European Conference and Exhibition on Optical Communication (ECOC 2013)
Abbreviated title	ECOC 2013
Country/Territory	United Kingdom
City	London
Period	22/09/13 → 26/09/13

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Keyvaninia, S., Verstuyft, S., Landschoot, van, L., Thourhout, Van, D., Roelkens, G. C., Duan, G.-H., Lelarge, F., Fedeli, J. M., Messaoudene, S., Vries, de, T., Geluk, E. J., Smalbrugge, E., & Smit, M. K. (2013). III-V/Silicon first order distributed feedback lasers integrated on SOI waveguide circuits. In Proceedings of the 39th European Conference and Exhibition on Optical Communication (ECOC 2013), 22-26 September 2013, London, United Kingdom (pp. Mo.4.B.3-1/4). Institute of Electrical and Electronics Engineers. https://doi.org/10.1049/cp.2013.1306

Keyvaninia, S. ; Verstuyft, S. ; Landschoot, van, L. et al. / III-V/Silicon first order distributed feedback lasers integrated on SOI waveguide circuits. Proceedings of the 39th European Conference and Exhibition on Optical Communication (ECOC 2013), 22-26 September 2013, London, United Kingdom. Piscataway : Institute of Electrical and Electronics Engineers, 2013. pp. Mo.4.B.3-1/4

@inproceedings{2f6890dbf43a471782af1018f053c728,

title = "III-V/Silicon first order distributed feedback lasers integrated on SOI waveguide circuits",

abstract = "Heterogeneously integrated III-V-on-silicon first order distributed feedback lasers utilizing an ultra-thin DVS-BCB die-to-wafer bonding process are reported. A novel design exploiting high confinement in the active waveguide is demonstrated. 5 mW output power coupled to a silicon waveguide, 40 dB side mode suppression ratio and continuous wave operation up to 60°C is obtained.",

author = "S. Keyvaninia and S. Verstuyft and {Landschoot, van}, L. and {Thourhout, Van}, D. and G.C. Roelkens and G.-H. Duan and F. Lelarge and J.M. Fedeli and S. Messaoudene and {Vries, de}, T. and E.J. Geluk and E. Smalbrugge and M.K. Smit",

year = "2013",

doi = "10.1049/cp.2013.1306",

language = "English",

pages = "Mo.4.B.3--1/4",

booktitle = "Proceedings of the 39th European Conference and Exhibition on Optical Communication (ECOC 2013), 22-26 September 2013, London, United Kingdom",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "39th European Conference and Exhibition on Optical Communication (ECOC 2013), ECOC 2013 ; Conference date: 22-09-2013 Through 26-09-2013",

}

Keyvaninia, S, Verstuyft, S, Landschoot, van, L, Thourhout, Van, D, Roelkens, GC, Duan, G-H, Lelarge, F, Fedeli, JM, Messaoudene, S, Vries, de, T, Geluk, EJ, Smalbrugge, E & Smit, MK 2013, III-V/Silicon first order distributed feedback lasers integrated on SOI waveguide circuits. in Proceedings of the 39th European Conference and Exhibition on Optical Communication (ECOC 2013), 22-26 September 2013, London, United Kingdom. Institute of Electrical and Electronics Engineers, Piscataway, pp. Mo.4.B.3-1/4, 39th European Conference and Exhibition on Optical Communication (ECOC 2013), London, United Kingdom, 22/09/13. https://doi.org/10.1049/cp.2013.1306

III-V/Silicon first order distributed feedback lasers integrated on SOI waveguide circuits. / Keyvaninia, S.; Verstuyft, S.; Landschoot, van, L. et al.
Proceedings of the 39th European Conference and Exhibition on Optical Communication (ECOC 2013), 22-26 September 2013, London, United Kingdom. Piscataway: Institute of Electrical and Electronics Engineers, 2013. p. Mo.4.B.3-1/4.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - III-V/Silicon first order distributed feedback lasers integrated on SOI waveguide circuits

AU - Keyvaninia, S.

AU - Verstuyft, S.

AU - Landschoot, van, L.

AU - Thourhout, Van, D.

AU - Roelkens, G.C.

AU - Duan, G.-H.

AU - Lelarge, F.

AU - Fedeli, J.M.

AU - Messaoudene, S.

AU - Vries, de, T.

AU - Geluk, E.J.

AU - Smalbrugge, E.

AU - Smit, M.K.

N1 - Conference code: 39

PY - 2013

Y1 - 2013

N2 - Heterogeneously integrated III-V-on-silicon first order distributed feedback lasers utilizing an ultra-thin DVS-BCB die-to-wafer bonding process are reported. A novel design exploiting high confinement in the active waveguide is demonstrated. 5 mW output power coupled to a silicon waveguide, 40 dB side mode suppression ratio and continuous wave operation up to 60°C is obtained.

AB - Heterogeneously integrated III-V-on-silicon first order distributed feedback lasers utilizing an ultra-thin DVS-BCB die-to-wafer bonding process are reported. A novel design exploiting high confinement in the active waveguide is demonstrated. 5 mW output power coupled to a silicon waveguide, 40 dB side mode suppression ratio and continuous wave operation up to 60°C is obtained.

U2 - 10.1049/cp.2013.1306

DO - 10.1049/cp.2013.1306

M3 - Conference contribution

SP - Mo.4.B.3-1/4

BT - Proceedings of the 39th European Conference and Exhibition on Optical Communication (ECOC 2013), 22-26 September 2013, London, United Kingdom

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

T2 - 39th European Conference and Exhibition on Optical Communication (ECOC 2013)

Y2 - 22 September 2013 through 26 September 2013

ER -

Keyvaninia S, Verstuyft S, Landschoot, van L, Thourhout, Van D, Roelkens GC, Duan GH et al. III-V/Silicon first order distributed feedback lasers integrated on SOI waveguide circuits. In Proceedings of the 39th European Conference and Exhibition on Optical Communication (ECOC 2013), 22-26 September 2013, London, United Kingdom. Piscataway: Institute of Electrical and Electronics Engineers. 2013. p. Mo.4.B.3-1/4 doi: 10.1049/cp.2013.1306

III-V/Silicon first order distributed feedback lasers integrated on SOI waveguide circuits

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