III-V photonic integrated circuits for beyond-telecom applications

Y. Jiao; L. Shen; Z. Cao; S. Latkowski; E.A.J.M. Bente; J.J.G.M. van der Tol; M.K. Smit; K.A. Williams

doi:10.1109/WOCC.2016.7506591

III-V photonic integrated circuits for beyond-telecom applications

Y. Jiao, L. Shen, Z. Cao, S. Latkowski, E.A.J.M. Bente, J.J.G.M. van der Tol, M.K. Smit, K.A. Williams

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

1 Citation (Scopus)

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Abstract

In this paper we introduce the III-V photonic integration platforms for emerging applications beyond telecommunications. Recent achievements in InP generic platform and InP membrane platform for wireless and sensing applications are reviewed. These realized chips show great potential of the InP-based photonic integration for its full functionality, high flexibility and high performance.

Original language	English
Title of host publication	2016 25th Wireless and Optical Communication Conference (WOCC 2016
Subtitle of host publication	Proceedings of a meeting held 21-23 May 2016, Chengdu, China.
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Number of pages	5
ISBN (Print)	9781467399593
DOIs	https://doi.org/10.1109/WOCC.2016.7506591
Publication status	Published - Jul 2016

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Jiao, Y., Shen, L., Cao, Z., Latkowski, S., Bente, E. A. J. M., van der Tol, J. J. G. M., Smit, M. K., & Williams, K. A. (2016). III-V photonic integrated circuits for beyond-telecom applications. In 2016 25th Wireless and Optical Communication Conference (WOCC 2016: Proceedings of a meeting held 21-23 May 2016, Chengdu, China. Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/WOCC.2016.7506591

@inproceedings{6c3681aa69724e92b09129d70c496cf2,

title = "III-V photonic integrated circuits for beyond-telecom applications",

abstract = "In this paper we introduce the III-V photonic integration platforms for emerging applications beyond telecommunications. Recent achievements in InP generic platform and InP membrane platform for wireless and sensing applications are reviewed. These realized chips show great potential of the InP-based photonic integration for its full functionality, high flexibility and high performance.",

author = "Y. Jiao and L. Shen and Z. Cao and S. Latkowski and E.A.J.M. Bente and {van der Tol}, J.J.G.M. and M.K. Smit and K.A. Williams",

year = "2016",

month = jul,

doi = "10.1109/WOCC.2016.7506591",

language = "English",

isbn = "9781467399593",

booktitle = "2016 25th Wireless and Optical Communication Conference (WOCC 2016",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

}

Jiao, Y, Shen, L, Cao, Z, Latkowski, S , Bente, EAJM , van der Tol, JJGM , Smit, MK & Williams, KA 2016, III-V photonic integrated circuits for beyond-telecom applications. in 2016 25th Wireless and Optical Communication Conference (WOCC 2016: Proceedings of a meeting held 21-23 May 2016, Chengdu, China.. Institute of Electrical and Electronics Engineers, Piscataway. https://doi.org/10.1109/WOCC.2016.7506591

III-V photonic integrated circuits for beyond-telecom applications. / Jiao, Y.; Shen, L.; Cao, Z. et al.
2016 25th Wireless and Optical Communication Conference (WOCC 2016: Proceedings of a meeting held 21-23 May 2016, Chengdu, China.. Piscataway: Institute of Electrical and Electronics Engineers, 2016.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - III-V photonic integrated circuits for beyond-telecom applications

AU - Jiao, Y.

AU - Shen, L.

AU - Cao, Z.

AU - Latkowski, S.

AU - Bente, E.A.J.M.

AU - van der Tol, J.J.G.M.

AU - Smit, M.K.

AU - Williams, K.A.

PY - 2016/7

Y1 - 2016/7

N2 - In this paper we introduce the III-V photonic integration platforms for emerging applications beyond telecommunications. Recent achievements in InP generic platform and InP membrane platform for wireless and sensing applications are reviewed. These realized chips show great potential of the InP-based photonic integration for its full functionality, high flexibility and high performance.

AB - In this paper we introduce the III-V photonic integration platforms for emerging applications beyond telecommunications. Recent achievements in InP generic platform and InP membrane platform for wireless and sensing applications are reviewed. These realized chips show great potential of the InP-based photonic integration for its full functionality, high flexibility and high performance.

U2 - 10.1109/WOCC.2016.7506591

DO - 10.1109/WOCC.2016.7506591

M3 - Conference contribution

SN - 9781467399593

BT - 2016 25th Wireless and Optical Communication Conference (WOCC 2016

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

ER -

Jiao Y, Shen L, Cao Z, Latkowski S , Bente EAJM , van der Tol JJGM et al. III-V photonic integrated circuits for beyond-telecom applications. In 2016 25th Wireless and Optical Communication Conference (WOCC 2016: Proceedings of a meeting held 21-23 May 2016, Chengdu, China.. Piscataway: Institute of Electrical and Electronics Engineers. 2016 Epub 2016. doi: 10.1109/WOCC.2016.7506591

III-V photonic integrated circuits for beyond-telecom applications

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